Staff Package Engineer

Power Integrations; Bayan Lepas; On-site; MYR 100,000 - 130,000; Full time

Job summary

A leading semiconductor company is looking for a motivated Staff Packaging Engineer in Penang, Malaysia. This role involves driving improvements in assembly yield, quality, and cost for mass production products and requires significant experience in semiconductor assembly processes. The ideal candidate will have at least 8 years of relevant experience, a Bachelor's degree in engineering, and strong project management and problem-solving skills. Fluency in English is essential.

Qualifications

• Minimum 8 years of experience in semiconductor assembly process, NPI engineering, or assembly subcontractor management.
• Hands-on experience in wire bonding and/or molding process is highly desirable.
• Strong understanding of assembly process control and requirements.

Responsibilities

• Drive improvement on assembly yield, quality, delivery, and cost for mass production products.
• Manage new product introduction at subcontractor factory.
• Support new products, process, and package development.
• Investigate and solve customer complaint cases.
• Perform regular process and quality audits at subcontractor site.
• Strong interaction with cross-functional teams on assembly engineering projects.

Skills

Project management

Problem-solving

Process control

Wire bonding

Molding process

Education

Bachelor’s degree or above in engineering

Job description

Staff Package Engineer

Power Integrations is looking for experienced talent with high motivation to serve as the Staff Packaging Engineer, managing and driving improvement in assembly and NPI engineering at a subcontractor factory. This role will be based in Penang, Malaysia.

Key Responsibilities

• Drive improvement on assembly yield, quality, delivery, and cost for mass production products.
• Manage new product introduction at subcontractor factory.
• Support new products, process, and package development.
• Investigate and solve customer complaint cases.
• Perform regular process and quality audits at subcontractor site.
• Strong interaction with cross‑functional teams on assembly engineering projects.

Qualifications

• Bachelor’s degree or above in engineering.
• Minimum 8 years of experience in semiconductor assembly process, NPI engineering, or assembly subcontractor management.
• Hands‑on experience in wire bonding and/or molding process is highly desirable.
• Good understanding of assembly process control and requirements.
• Strong project management and problem‑solving skills.
• Fluent in English.
• Technically competent, self‑motivated, strong commitment, and assertive.