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Job summary
A leading semiconductor company is looking for a motivated Staff Packaging Engineer in Penang, Malaysia. This role involves driving improvements in assembly yield, quality, and cost for mass production products and requires significant experience in semiconductor assembly processes. The ideal candidate will have at least 8 years of relevant experience, a Bachelor's degree in engineering, and strong project management and problem-solving skills. Fluency in English is essential.
Qualifications
Minimum 8 years of experience in semiconductor assembly process, NPI engineering, or assembly subcontractor management.
Hands-on experience in wire bonding and/or molding process is highly desirable.
Strong understanding of assembly process control and requirements.
Responsibilities
Drive improvement on assembly yield, quality, delivery, and cost for mass production products.
Manage new product introduction at subcontractor factory.
Support new products, process, and package development.
Investigate and solve customer complaint cases.
Perform regular process and quality audits at subcontractor site.
Strong interaction with cross-functional teams on assembly engineering projects.
Skills
Project management
Problem-solving
Process control
Wire bonding
Molding process
Education
Bachelor’s degree or above in engineering
Job description
A leading semiconductor company is looking for a motivated Staff Packaging Engineer in Penang, Malaysia. This role involves driving improvements in assembly yield, quality, and cost for mass production products and requires significant experience in semiconductor assembly processes. The ideal candidate will have at least 8 years of relevant experience, a Bachelor's degree in engineering, and strong project management and problem-solving skills. Fluency in English is essential.