Staff Engineer-Lead frame & Package Design

Wolfspeed; Ipoh; On-site; MYR 90,000 - 150,000; Full time

Job summary

Wolfspeed in Ipoh, Malaysia is seeking a Staff Engineer to lead frame and package design for new platforms and devices. You will generate and review designs, ensuring proper documentation in PDM and contributing to assembly/test design rules and DFM analyses.

The role requires a university engineering degree and 5–8 years in related fields, with AutoCAD experience and strong mechanical design skills in semiconductor packaging. Working knowledge of stack-up tolerancing is advantageous.

Qualifications

• University degree in engineering with mechanical design exposure.
• Minimum 5–8 years in related field with packaging/lead-frame design experience.
• Knowledge of assembly/test design rules and DFM is preferred.

Responsibilities

• Design-generation and reviews for new packages or platforms, including lead-frame and package outline.
• Maintain documents in PDM for design changes and releases.
• Participate in Assembly & Test Design Rules and DFM; perform stack-up tolerancing analyses.

Skills

AutoCAD

2D/3D mechanical design

Semiconductor packaging

Lead frame design

FEA (advantage)

Education

Engineering degree (University graduate)

Tools

AutoCAD

Job description

## Staff Engineer-Lead frame & Package DesignApply: Ipoh, Malaysia: Full time: Posted Today: 26-845* Performs design-generation and reviews for new packages or platforms which includes component , sub-assembly and Package Outline for new platforms and new devices* Ensures that the appropriate documents are in place for all new & existing design changes in PDM* Participate in Assembly & Test Design Rules, Design of Manufacturing (DFM) and Feasibility studies which includes mechanical stack-up tolerancing to ensure an design is optimised for cost and manufacturability* Maintenance & revision of Design rules to ensure they are up to date taking into account Suppliers, equipment & Customer capabilities and requirements respectively.* Knowledge of semiconductor Assembly/Test manufacturing and FEA simulation is an advantage* Performs other functions as may be assigned from time to time by superior. **Job Specification*** Education/Knowledge: University graduate, preferably of an Engineering course with knowledge in mechanical design(2D &3D) Software* Skills: Excellent Computer skills* Work Experience: At least 5 to 8 years in same/related field, with AutoCAD experience especially in Semiconductor Packaging & Lead frame design