Staff Engineer: Lead Frame & Package Design

MY01 Wolfspeed Malaysia Sdn. Bhd.; Ipoh; On-site; MYR 110,000 - 180,000; Full time

Job summary

Wolfspeed Malaysia Sdn. Bhd. seeks an experienced design engineer to develop and review packaging schemes for components and lead frames, ensuring cost and manufacturability targets are met.

Requirements include a university degree in engineering, 5–8 years in related fields, and strong AutoCAD skills for semiconductor packaging and lead-frame design. Familiarity with PDM, design rules, and DFM is preferred.

Qualifications

• University graduate with engineering background; knowledge in mechanical design (2D & 3D).
• At least 5–8 years in same/related field; AutoCAD experience essential in Semiconductor Packaging & Lead frame design.

Responsibilities

• Design-generation and reviews for new packages and platforms, including component, sub-assembly, and Package Outline.
• Ensure documentation in PDM for design changes; participate in Design Rules, DFM, and feasibility studies.
• Maintain and revise design rules considering suppliers, equipment, and customer needs; knowledge of assembly/test manufacturing and FEA a plus.

Skills

Mechanical design

AutoCAD

Education

Engineering degree

Tools

AutoCAD

Job description

Wolfspeed Malaysia Sdn. Bhd. seeks an experienced design engineer to develop and review packaging schemes for components and lead frames, ensuring cost and manufacturability targets are met.

Requirements include a university degree in engineering, 5–8 years in related fields, and strong AutoCAD skills for semiconductor packaging and lead-frame design. Familiarity with PDM, design rules, and DFM is preferred.