Staff Engineer-Lead frame & Package Design

MY01 Wolfspeed Malaysia Sdn. Bhd.; Ipoh; On-site; MYR 110,000 - 180,000; Full time

Job summary

Wolfspeed Malaysia Sdn. Bhd. seeks an experienced design engineer to develop and review packaging schemes for components and lead frames, ensuring cost and manufacturability targets are met.

Requirements include a university degree in engineering, 5–8 years in related fields, and strong AutoCAD skills for semiconductor packaging and lead-frame design. Familiarity with PDM, design rules, and DFM is preferred.

Qualifications

• University graduate with engineering background; knowledge in mechanical design (2D & 3D).
• At least 5–8 years in same/related field; AutoCAD experience essential in Semiconductor Packaging & Lead frame design.

Responsibilities

• Design-generation and reviews for new packages and platforms, including component, sub-assembly, and Package Outline.
• Ensure documentation in PDM for design changes; participate in Design Rules, DFM, and feasibility studies.
• Maintain and revise design rules considering suppliers, equipment, and customer needs; knowledge of assembly/test manufacturing and FEA a plus.

Skills

Mechanical design

AutoCAD

Education

Engineering degree

Tools

AutoCAD

Job description

Performs design-generation and reviews for new packages or platforms which includes component , sub-assembly and Package Outline for new platforms and new devices Ensures that the appropriate documents are in place for all new & existing design changes in PDM Participate in Assembly & Test Design Rules, Design of Manufacturing (DFM) and Feasibility studies which includes mechanical stack-up tolerancing to ensure an design is optimised for cost and manufacturability Maintenance & revision of Design rules to ensure they are up to date taking into account Suppliers, equipment & Customer capabilities and requirements respectively. Knowledge of semiconductor Assembly/Test manufacturing and FEA simulation is an advantage Performs other functions as may be assigned from time to time by superior.

Job Specification Education/Knowledge: University graduate, preferably of an Engineering course with knowledge in mechanical design(2D &3D) Software Skills: Excellent Computer skills Work Experience: At least 5 to 8 years in same/related field, with AutoCAD experience especially in Semiconductor Packaging & Lead frame design

Wolfspeed is a powerhouse semiconductor company focused on silicon carbide and GaN technologies. After more than thirty years of forging new technology adoption and transformation, our Wolfspeed power and radio frequency (RF) semiconductors are leading the industry through unrivaled expertise and capacity.