Senior Lead Frame & Package Design Engineer

Wolfspeed; Ipoh; On-site; MYR 90,000 - 150,000; Full time

Job summary

Wolfspeed in Ipoh, Malaysia is seeking a Staff Engineer to lead frame and package design for new platforms and devices. You will generate and review designs, ensuring proper documentation in PDM and contributing to assembly/test design rules and DFM analyses.

The role requires a university engineering degree and 5–8 years in related fields, with AutoCAD experience and strong mechanical design skills in semiconductor packaging. Working knowledge of stack-up tolerancing is advantageous.

Qualifications

• University degree in engineering with mechanical design exposure.
• Minimum 5–8 years in related field with packaging/lead-frame design experience.
• Knowledge of assembly/test design rules and DFM is preferred.

Responsibilities

• Design-generation and reviews for new packages or platforms, including lead-frame and package outline.
• Maintain documents in PDM for design changes and releases.
• Participate in Assembly & Test Design Rules and DFM; perform stack-up tolerancing analyses.

Skills

AutoCAD

2D/3D mechanical design

Semiconductor packaging

Lead frame design

FEA (advantage)

Education

Engineering degree (University graduate)

Tools

AutoCAD

Job description

Wolfspeed in Ipoh, Malaysia is seeking a Staff Engineer to lead frame and package design for new platforms and devices. You will generate and review designs, ensuring proper documentation in PDM and contributing to assembly/test design rules and DFM analyses.

The role requires a university engineering degree and 5–8 years in related fields, with AutoCAD experience and strong mechanical design skills in semiconductor packaging. Working knowledge of stack-up tolerancing is advantageous.