Staff Engineer-Lead frame & Package Design

Wolfspeed Malaysia Sdn. Bhd.; Ipoh; On-site; MYR 89,000 - 134,000; Full time

Job summary

Wolfspeed Malaysia Sdn. Bhd. is seeking an experienced mechanical design engineer to lead 2D/3D packaging tasks for new devices in Malaysia. You will design, review and optimise package outlines and lead frame concepts to balance performance and manufacturability.

The role requires 5–8 years in semiconductor packaging, strong AutoCAD skills, and the ability to work with cross-functional teams to ensure documentation and process compliance.

Qualifications

• Engineering degree; 2D/3D mechanical design knowledge.
• Minimum 5–8 years in semiconductor packaging/lead frame design.
• Proficient in AutoCAD and related CAD tools.

Responsibilities

• Perform design-generation and reviews for new packages and platforms, including component and package outline.
• Maintain and revise design rules; ensure documents exist for all design changes in PDM.
• Support Assembly & Test Design Rules, DFM studies and cost/ manufacturability optimisation.
• Participate in feasibility studies and consider tolerancing for cost efficiency.
• Assist in related tasks as directed by supervisor.

Skills

2D design

3D design

Mechanical design

Semiconductor packaging

Lead frame design

Education

Bachelor's degree in Engineering

Tools

AutoCAD

FEA simulation

Job description

Performs design-generation and reviews for new packages or platforms which includes component , sub-assembly and Package Outline for new platforms and new devicesEnsures that the appropriate documents are in place for all new & existing design changes in PDMParticipate in Assembly & Test Design Rules, Design of Manufacturing (DFM) and Feasibility studies which includes mechanical stack-up tolerancing to ensure an design is optimised for cost and manufacturabilityMaintenance & revision of Design rules to ensure they are up to date taking into account Suppliers, equipment & Customer capabilities and requirements respectively.Knowledge of semiconductor Assembly/Test manufacturing and FEA simulation is an advantagePerforms other functions as may be assigned from time to time by superior.Job SpecificationEducation/Knowledge: University graduate, preferably of an Engineering course with knowledge in mechanical design(2D &3D) SoftwareSkills: Excellent Computer skillsWork Experience: At least 5 to 8 years in same/related field, with AutoCAD experience especially in Semiconductor Packaging & Lead frame design