SiP Packaging Engineer: From Concept to High-Volume

Sandisk; George Town; Sur place; MYR 70 000 - 110 000; Plein temps

Résumé du poste

Sandisk in Penang, Malaysia is seeking an SiP package integration engineer to lead new SiP product development from concept to mass production. You will work with global teams across the US, India, China, and Taiwan to review designs and optimize manufacturing processes.

The role emphasizes DFx analyses, yield improvement, and readiness for high-volume production, with a focus on reliability, quality, cost, and manufacturability.

Qualifications

• Master’s degree in Material Science, Polymer Science, Mechanical Engineering, or related field.
• Bachelor’s degree with at least 2 years of relevant work experience.
• Experience in semiconductor packaging/SIP assembly is preferred.
• Strong problem solving and statistical analysis skills.

Responsabilités

• Lead SiP product development from concept design to mass production.
• Review design drawings with global teams and propose manufacturing options.
• Perform DFx analyses and validate designs through characterization builds.
• Drive yield improvements and manage excursions to meet quality targets.
• Ensure FMEA, Control Plans, and process documentation are ready for high-volume production.

Connaissances

Problem solving

Statistical analysis

Communication

Formation

Master's degree in Material Science/Polymer Science/Mechanical Engineering or related field

Bachelor's degree with 2+ years of relevant experience

Description du poste

Sandisk in Penang, Malaysia is seeking an SiP package integration engineer to lead new SiP product development from concept to mass production. You will work with global teams across the US, India, China, and Taiwan to review designs and optimize manufacturing processes.

The role emphasizes DFx analyses, yield improvement, and readiness for high-volume production, with a focus on reliability, quality, cost, and manufacturability.