Senior PFA Engineer: SEM/FIB for Chip Packaging

Sandisk; Batu Kawan; Vor Ort; MYR 90.000 - 150.000; Vollzeit

Zusammenfassung

Sandisk is seeking an experienced Device PFA Engineer in Malaysia to lead hands-on SEM and FIB failure analysis for advanced semiconductor devices and packages. You will partner with wafer fabrication, package design, and characterization teams to drive reliability and guide design decisions.

The role requires a Bachelor's degree and 3+ years of SEM/FIB experience, strong analytical skills, and the ability to collaborate across global teams in a fast-paced environment.

Qualifikationen

• Bachelor's degree in relevant discipline.
• Strong understanding of device structures, packaging architectures, and failure mechanisms.
• 3+ years hands-on SEM and FIB experience.
• Solid experience in physical failure analysis (PFA) of semiconductor devices.
• Good English communication skills, written and spoken.
• Ability to work effectively in cross-functional, global teams.

Aufgaben

• Develop and maintain package recipe and process baselines based on FA findings.
• Collaborate with fab process, package design, assembly R&D, and characterization teams.
• Evaluate package reliability and robustness in response to fab process changes.
• Lead package evaluation and qualification for NAND and ASIC technologies.
• Support chip structure optimization through detailed FA results and recommendations.
• Perform device-level physical failure analysis (PFA) using SEM and FIB techniques.
• Conduct FIB cross-sectioning, delayering, and defect localization for root-cause analysis.
• Utilize SEM imaging to analyze device structures, interfaces, and failure mechanisms.
• Identify and resolve structural and packaging-related reliability issues.
• Provide FA insights to influence package and product design decisions.

Kenntnisse

SEM & FIB hands-on experience

Ausbildung

Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related disciplines

Tools

SEM

FIB

Jobbeschreibung

Sandisk is seeking an experienced Device PFA Engineer in Malaysia to lead hands-on SEM and FIB failure analysis for advanced semiconductor devices and packages. You will partner with wafer fabrication, package design, and characterization teams to drive reliability and guide design decisions.

The role requires a Bachelor's degree and 3+ years of SEM/FIB experience, strong analytical skills, and the ability to collaborate across global teams in a fast-paced environment.