SiP Packaging Engineer: From Concept to Production

Sandisk

Batu Kawan

On-site

MYR 78,120 - 167,400

Full time

14 days+

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Job summary

Sandisk in Malaysia's Penang region seeks a SiP packaging integration engineer within the packaging engineering group. You will lead new SiP product development from concept through mass production, translating innovative concepts into market-ready solutions while collaborating with global teams.

The role requires a Master’s or equivalent in materials/engineering, strong problem-solving and communication skills, and a track record in semiconductor packaging.

Qualifications

Master’s degree in Material Science, Polymer Science, Mechanical Engineering, or related field; or Bachelor’s with 2+ years of relevant experience.
Proficient understanding of packaging domains in semiconductor SiP assembly (DP/DA/WB/Mold & backend process) and packaging materials; knowledge of board-level reliability and Finite Element Analysis is a plus.

Responsibilities

Lead SiP package integration from concept to mass production, optimizing design for manufacturing.
Collaborate with global teams (US/India/China/Taiwan), review design drawings, validate options, and perform DFx analyses and simulations.
Ensure build readiness, execute package qualification, monitor yields, and drive improvements.
Lead technology transition from engineering to volume production with appropriate controls.
Drive new product introduction from low to high volume while achieving yield and quality goals.

Skills

Problem solving

Communication

Education

Master’s degree in materials/engineering

Bachelor’s degree with 2+ years experience

Job description

The role requires a Master’s or equivalent in materials/engineering, strong problem-solving and communication skills, and a track record in semiconductor packaging.

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