Senior Packaging Engineering Lead — Global Innovation & Yield

Sandisk; Batu Kawan; On-site; MYR 180,000 - 240,000; Full time

Job summary

Sandisk seeks a detail-oriented Senior Staff, Packaging Engineering to join our Penang, Malaysia team. You will drive packaging solutions across product lines, ensuring efficiency, quality, and regulatory compliance while collaborating with global functions to design, develop, and optimize packaging systems that meet customer requirements.

The ideal candidate will lead end-to-end packaging lifecycle, drive continuous improvement, and oversee readiness for high-volume production with robust DFx

Qualifications

• Master’s degree or PhD in Materials Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines.
• Minimum 10 years of relevant work experience with a Master's degree, or 8+ years of experience with a PhD.
• Proficient understanding of packaging domains including SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout
• Additional expertise in flash back-end process for active components manufacturing is a plus
• Experience with machine learning and data analytics utilizing AI technologies.

Responsibilities

• Serve as the Package Engineering representative on cross functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
• Provide end to end ownership of the package lifecycle across design, development, qualification, and manufacturing, driving alignment among cross functional engineering teams, global factories, and key stakeholders.
• Lead global engagement with factories and contract manufacturers to enable robust, scalable, and cost effective high volume introduction of new package designs and advanced assembly processes.
• Partner with Packaging R&D organizations worldwide to define, develop, and qualify next generation and emerging packaging technologies in alignment with long term business strategy and product roadmaps
• Drive enterprise level assembly yield improvement initiatives and package cost reduction programs, establishing best practices and measurable performance targets across supported product lines.
• Own package technology roadmaps, oversee budgets for supported products, and guide the development of scalable packaging infrastructure to support future growth and technology transitions.
• Lead new products through the transition from low volume to high volume manufacturing, ensuring yield, quality, and reliability objectives are achieved. Establish and enforce readiness of FMEA, SOD, Control Plans, process recipes, SPC, and other critical assembly controls prior to high volume production.
• Provide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level.

Skills

Packaging expertise

Statistical analysis

Cross-functional collaboration

Communication skills

Education

Master's degree in Materials Science

PhD in related field

Tools

Machine Learning

Data Analytics

AI technologies

PCB Layout tools

Job description

Sandisk seeks a detail-oriented Senior Staff, Packaging Engineering to join our Penang, Malaysia team. You will drive packaging solutions across product lines, ensuring efficiency, quality, and regulatory compliance while collaborating with global functions to design, develop, and optimize packaging systems that meet customer requirements.

The ideal candidate will lead end-to-end packaging lifecycle, drive continuous improvement, and oversee readiness for high-volume production with robust DFx