Underfill Process Engineer: Yield, NPI & Process Innovation

Sandisk

Batu Kawan

On-site

MYR 90,000 - 150,000

Full time

14 days+

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Job summary

Sandisk is seeking an experienced Underfill Process Engineer to join our Malaysia fabrication team in Penang. You will lead the Underfill process development and sustainment, drive process improvements, and ensure CTQ, CPK, and yield targets are met in a high-volume environment.

You will collaborate with Quality, Manufacturing, and Product Engineering to develop golden recipes, document procedures, and train operators on best practices while supporting new product introductions and process

Qualifications

Bachelor's Degree or higher in Engineering (Electrical, Mechanical, Physics, Materials Science, or related).
4–5 years of semiconductor assembly process engineering experience.
Experience in Underfill process development and sustaining.
Strong knowledge of semiconductor assembly processes and flip-chip die-level assembly technology.
Hands-on with production support, yield improvement, and quality excellence.
Familiar with FMEA, SPC, 8D, Six Sigma, DOE, and tools like Minitab/JMP.

Responsibilities

Responsible for the Underfill (UF) process for flip-chip die-level assembly.
Support Assembly Process Engineering in delivering process and equipment solutions that meet quality, development, and operational requirements.
Maintain assembly yield and test yield related to the Underfill process in line with targets and KPIs.
Set up new Underfill processes, materials, and recipes, including DOE execution and corner limit evaluations.
Establish golden recipes for new package qualifications.
Lead process qualifications to achieve CTQ, CPK, risk assessment, UPH, yield and cost objectives.