Senior Wirebond Process Engineer: Process Improvement Pro

Texas Instruments; Malacca City; On-site; MYR 90,000 - 140,000; Full time

Benefits offered by this job

Competitive pay and benefits

Job summary

Texas Instruments is seeking an energetic Manufacturing Process Engineer in Malaysia to drive continuous improvements in wirebond-based semiconductor manufacturing. You’ll develop and implement better methods to improve efficiencies, yields, machine performance and product quality, while supporting wirebond processes for customer deliverables.

You will document process details, define materials for applications, and establish statistical monitoring methods.

Qualifications

• Bachelor’s degree in a related engineering/physical science field with CGPA > 3.3
• Experience with wirebond manufacturing processes in semiconductor operations
• Strong foundation in SPC, ECR, and process release strategies
• Ability to define materials for wirebond applications and monitor processes
• Experience in data analysis and problem resolution

Responsibilities

• Develop and implement improved manufacturing methods to enhance efficiency, yield, and quality
• Support wirebond processes for customer deliverables
• Document wirebond process details in specifications and work instructions
• Define wirebond materials for specific applications (wire type, capillary part numbers)
• Define statistical monitoring methods for developed wirebond processes
• Implement improvement plans for efficiency, cost reduction, or quality programs
• Assist in ramp-up with equipment startup and SWR process experiments
• Participate in data analysis and problem resolution

Skills

Wirebond experience

Statistical process control

Process engineering

Data analysis

Cross-functional collaboration

Education

Bachelor’s degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics

Tools

KNS wirebond machine

ASM wirebond machine

Wedge bonder

Job description

Texas Instruments is seeking an energetic Manufacturing Process Engineer in Malaysia to drive continuous improvements in wirebond-based semiconductor manufacturing. You’ll develop and implement better methods to improve efficiencies, yields, machine performance and product quality, while supporting wirebond processes for customer deliverables.

You will document process details, define materials for applications, and establish statistical monitoring methods.