Senior Wirebond Equipment Engineer - Onsite Melaka

Texas Instruments; Malacca City; On-site; MYR 120,000 - 180,000; Full time

Job summary

Texas Instruments Malaysia in Melaka, Malaysia, is seeking a Senior Wirebond Process/Equipment Engineer to drive equipment selection, installation, maintenance, and uptime improvements in a semiconductor manufacturing setting. The role is on-site at Batu Berendam, Malacca.

Ideal candidates have 5+ years of experience with KNS/ASM wire bond systems, strong problem-solving and collaboration skills, and a background in electronics or mechanical engineering. Bachelor’s degree required.

Qualifications

• Bachelor degree in Electronics, Electrical, Mechanical or related field.
• Minimum 5 years as Wirebond Equipment Engineer with KNS and ASM experience.
• Semiconductor manufacturing knowledge and hands-on wire bond experience preferred.
• On-site full-time role at TI Malaysia, Batu Berendam, Malacca.

Responsibilities

• Evaluate, select and order equipment for cost-effective manufacturing.
• Oversee installation, modification, upgrade and maintenance of equipment.
• Keep up with manufacturers' notices, upgrades and safety issues.
• Study equipment performance and reliability; improve uptime.
• Provide technical support to manufacturing equipment repair and process teams.
• Define and write preventative maintenance schedules.

Skills

Wirebond process experience

Analytical skills

Problem solving

Team collaboration

Time management

Education

Bachelor's degree in Electronics or Electrical Engineering or Mechanical Engineering

Tools

KNS wire bond machine

ASM wire bond machine

Gold/Cu/PCC wire & bump ball bonding

Job description

Texas Instruments Malaysia in Melaka, Malaysia, is seeking a Senior Wirebond Process/Equipment Engineer to drive equipment selection, installation, maintenance, and uptime improvements in a semiconductor manufacturing setting. The role is on-site at Batu Berendam, Malacca.

Ideal candidates have 5+ years of experience with KNS/ASM wire bond systems, strong problem-solving and collaboration skills, and a background in electronics or mechanical engineering. Bachelor’s degree required.