Senior Wirebond Equipment Engineer – Shape Semiconductors Onsite

118-WW TMG MFG OPS; Malacca City; On-site; MYR 90,000 - 130,000; Full time

Job summary

Texas Instruments Malaysia, Batu Berendam, Malacca, seeks a Wire Bond Equipment Engineer to lead evaluation, installation, and maintenance of wafer fabrication equipment. You will study performance, implement uptime improvements, and provide strong technical support across process engineering and repair teams.

The role requires a minimum of 5 years’ experience with KNS and ASM wirebond systems, hands-on equipment maintenance, and a solid background in electronics or electrical engineering.

Qualifications

• Bachelor Degree of Electronics or Electrical engineering, Mechanical Engineering or related engineering degree.
• Minimum 5 years as Wirebond Equipment Engineer with KNS and ASM wirebond equipment maintenance experience in semiconductor manufacturing operations.

Responsibilities

• Evaluating, selecting, and ordering equipment that is most appropriate and cost effective for the manufacture of company products.
• Overseeing the installation, modification, upgrade and maintenance of manufacturing equipment.
• Keeping current on equipment manufacturers' technical notices, upgrades and safety issues.
• Studying equipment performance and reliability.
• Establishing programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process.
• Providing technical support to the manufacturing equipment repair and process engineering organizations.
• Defining and writing preventative maintenance schedules.

Skills

Wire bond

KNS

ASM

Electronics

Electrical engineering

Mechanical engineering

Analytical thinking

Team collaboration

Time management

Problem solving

Education

Bachelor degree in Electronics or Electrical Engineering

Mechanical Engineering

Tools

KNS wire bond equipment

ASM wire bond machine

SPC/Spotfire

Job description

Texas Instruments Malaysia, Batu Berendam, Malacca, seeks a Wire Bond Equipment Engineer to lead evaluation, installation, and maintenance of wafer fabrication equipment. You will study performance, implement uptime improvements, and provide strong technical support across process engineering and repair teams.

The role requires a minimum of 5 years’ experience with KNS and ASM wirebond systems, hands-on equipment maintenance, and a solid background in electronics or electrical engineering.