Die Bond & Attach Equipment Lead — Uptime & Innovation

118-WW TMG MFG OPS; Kuala Lumpur; On-site; MYR 180,000 - 240,000; Full time

Job summary

Texas Instruments is seeking an Equipment Engineer in Malaysia to evaluate, select, and manage manufacturing equipment used in die bond and die attach processes. You will oversee installation, upgrades, and maintenance while staying current with safety notices and equipment reliability.

The role requires a minimum of 5 years hands-on experience with die bond/die attach equipment and a Bachelor's degree in Electrical/related engineering.

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• Minimum 5 years of die bond or die attach equipment hands-on experience.

Responsibilities

• Evaluating, selecting, and ordering equipment most appropriate and cost effective for manufacture of company products.
• Overseeing installation, modification, upgrade and maintenance of manufacturing equipment.
• Keeping current on equipment manufacturers' technical notices, upgrades and safety issues.
• Studying equipment performance and reliability.
• Establishing programs and solutions for increasing uptime and addressing equipment problems in the manufacturing process.
• Providing technical support to the manufacturing equipment repair and process engineering organizations.
• Defining and writing preventative maintenance schedules.

Skills

Die bond equipment hands-on experience

Education

Bachelor's degree in Electrical Engineering

Job description

Texas Instruments is seeking an Equipment Engineer in Malaysia to evaluate, select, and manage manufacturing equipment used in die bond and die attach processes. You will oversee installation, upgrades, and maintenance while staying current with safety notices and equipment reliability.

The role requires a minimum of 5 years hands-on experience with die bond/die attach equipment and a Bachelor's degree in Electrical/related engineering.