Senior Wirebond Process/Equipment Engineer

Texas Instruments; Malacca City; On-site; MYR 120,000 - 180,000; Full time

Job summary

Texas Instruments Malaysia seeks an experienced Wire Bond Equipment Engineer to join a dynamic team focused on supporting semiconductor manufacturing. You will evaluate, select, and maintain wire bond equipment, ensuring high uptime and reliability for TI products.

You will collaborate with repair and process engineering teams to optimize processes and prevent downtime. The role requires a minimum of five years in wire bond equipment maintenance with KNS and ASM systems, with strong attention to

Qualifications

• Bachelor degree in Electronics or Electrical engineering, Mechanical Engineering or related engineering degree.
• Minimum 5 years as Wirebond Equipment Engineer with KNS and ASM wirebond equipment maintenance in semiconductor manufacturing operations.
• Experience with wire bond processes and related equipment is highly advantageous.
• Work arrangement: Full-time onsite role at Texas Instruments Malaysia, Batu Berendam, Malacca.

Responsibilities

• Evaluating, selecting and ordering equipment for cost-effective manufacture of TI products.
• Overseeing installation, modification, upgrade and maintenance of manufacturing equipment.
• Staying current on manufacturers' technical notices, upgrades and safety issues.
• Studying equipment performance and reliability; identifying uptime improvements.
• Providing technical support within manufacturing equipment repair and process engineering teams.
• Defining and writing preventative maintenance schedules.

Skills

Wire bond process

Team collaboration

Problem solving

Verbal & written communication

Education

Bachelor degree in Electronics or Electrical engineering

Mechanical Engineering or related engineering degree

Tools

KNS wire bond machine

ASM wire bond machine

Wire bond equipment maintenance

Gold/Cu/PCC wire bonding

Die coat / plasma equipment

Job description

Change the world. Love your job.

Do you want to work for an organization that values your opinion? Do you want to work for an organization where you can play a pivotal role in several different areas? Look no further. As a Texas Instruments Wire Bond Equipment Engineer, you will have the opportunity to work in a vibrant and dynamic team oriented environment.

Responsibilities include:

• Evaluating, selecting, and ordering equipment that is most appropriate and cost effective for the manufacture of company products

• Overseeing the installation, modification, upgrade and maintenance of manufacturing equipment

• Keeping current on equipment manufacturers' technical notices, upgrades and safety issues

• Studying equipment performance and reliability

• Establishing programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process

• Providing technical support to the manufacturing equipment repair and process engineering organizations

• Defining and writing preventative maintenance schedules

Why TI?

• Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.

• We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI (https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012)

• Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here (https://careers.ti.com/en/sites/CX/pages/benefits)

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.

Minimum Requirements:

• Bachelor Degree of Electronics or Electrical engineering, Mechanical Engineering or related engineering degree

• Minimum 5 years as Wirebond Equipment Engineer with KNS and ASM wirebond equipment maintenance experience in semiconductor manufacturing operations

• Equipped with Wirebond process experiences will be added advantage

• Work Arrangement: Full-time, onsite role based at Texas Instruments Malaysia, Batu Berendam, Malacca.

Preferred Qualifications:

• Equipment experience with Wire bond process, must be able to hands on KNS and ASM wire bond machine

• Prior experience with Gold/Cu/PCC wire & Bump ball process bonding

• Equipment experience on other equipment post wire bond process (e.g., plasma, Die coat)

• Experience on tool monitoring and interdiction software, and equipment maintenance and documentation

• Working knowledge of semiconductor manufacturing, and SPC/Spotfire techniques. Experienced with semiconductor cleanroom protocol and behaviors.

• Strong verbal and written communication skills

• Demonstrated strong analytical, critical thinking and problem solving skills

• Ability to work in teams and collaborate effectively with people in different functions

• Ability to take the initiative and drive for results

• Strong time management skills that enable on-time project delivery

• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment

• Demonstrated ability to build strong, influential relationships

ECL/GTC Required: Yes