Engineer I, Process Sustaining Engineering

ASE SEMICONDUCTOR (PENANG) SDN. BHD.; Bayan Lepas; On-site; MYR 45,000 - 78,000; Full time

Job summary

ASE SEMICONDUCTOR (PENANG) SDN. BHD. in Bayan Lepas is seeking a capable Process Engineer for semiconductor assembly / wire bonding to drive yield improvements and cost reductions using 6-sigma methods.

You'll lead a team of Wire Bond engineers and technicians, provide technical guidance, and collaborate with R&D and product development to meet CQ requirements and ramp new processes.

Qualifications

• 0–3 years of working experience in semiconductor assembly, wire bonding, process engineering, or related manufacturing environment.
• Fresh graduates with relevant academic background and strong technical interest in semiconductor manufacturing are encouraged to apply.
• Possess good knowledge and skills in manufacturing process & equipment.
• Possess knowledge in DOE, 8D Problem Solving, FMEA, SPC, Minitab.
• Creative problem solving skill and well equipped with critical thinking & creativity to analyze and solve problem
• Team lead with effective communication and interpersonal skills

Responsibilities

• Participate and lead various yield & quality improvement programs and cost reduction activities by using 6-sigma methodologies
• Lead a team of Wire Bond engineers and technicians, cross functional team.
• Provide technical consultation and guidance to ensure team success in daily tasks and projects
• Define the cutting edge of wire bond technology roadmap
• Evaluate new materials (wire), new processes, and new equipment for current and future needs.
• Work with R&D team to sets up and ramp new manufacturing processes to meet process Critical to quality requirements, CPK, full risk assessment, UPH, Yield, and cost targets to ensure ramp robustness/readiness of new products
• Work closely with product development team to understand the package design rules & requirements.

Skills

Creative problem solving

Communication

Interpersonal skills

Team leadership

Tools

DOE

8D Problem Solving

FMEA

SPC

Minitab

Job description

Participate and lead various yield & quality improvement programs and cost reduction activities by using 6-sigma methodologies

Leading a of Wire Bond engineers and technicians, cross functional team.

Provide technical consultation and guidance to ensure team success in daily tasks and projects

Define the cutting edge of wire bond technology roadmap

Evaluate new materials (wire), new processes, and new equipment for current and future needs.

Work with R&D team to sets up and ramp new manufacturing processes to meet process Critical to quality requirements, CPK, full risk assessment, UPH, Yield, and cost targets to ensure ramp robustness/readiness of new products

Work closely with product development team to understand the package design rules & requirements.

Qualifications

0–3 years of working experience in semiconductor assembly, wire bonding, process engineering, or related manufacturing environment.

Fresh graduates with relevant academic background and strong technical interest in semiconductor manufacturing are encouraged to apply.

Possess good knowledge and skills in manufacturing process & equipment.

Possess knowledge in DOE, 8D Problem Solving, FMEA, SPC, Minitab.

Creative problem solving skill and well equipped with critical thinking & creativity to analyze and solve problem

Team lead with effective communication and interpersonal skills