Wire Bond Process Specialist — Optimize & Troubleshoot

NXP Semiconductors; Kuala Lumpur; On-site; MYR 33,000 - 60,000; Full time

Job summary

NXP Semiconductors is seeking a diploma-holding engineer in Kuala Lumpur to perform wire bond tasks on quality hold material and work with engineering to refine WB processes. You will help resolve WB-related issues to reduce downtime and improve production efficiency, requiring strong attention to detail and basic troubleshooting skills.

Experience with wire bond is a plus, and a proactive, detail-oriented mindset is essential for success in this role in our Malaysia facility.

Qualifications

• Diploma or above in Engineering or a related field.
• Working experience with WB process is preferable.
• Strong attention to detail and technical troubleshooting skills.

Responsibilities

• Perform wire bond process task on quality hold material.
• Collaborate with engineering to improve WB processes and techniques.
• Assist in resolving WB-related issues to minimize production downtime.

Skills

Attention to detail

Technical troubleshooting

Education

Diploma or above in Engineering or related field

Job description

NXP Semiconductors is seeking a diploma-holding engineer in Kuala Lumpur to perform wire bond tasks on quality hold material and work with engineering to refine WB processes. You will help resolve WB-related issues to reduce downtime and improve production efficiency, requiring strong attention to detail and basic troubleshooting skills.

Experience with wire bond is a plus, and a proactive, detail-oriented mindset is essential for success in this role in our Malaysia facility.