Wire Bond Senior Equipment Sustaining Engineer

Nexperia; Seremban; On-site; MYR 200,000 - 260,000; Full time

Job summary

Nexperia in Malaysia is seeking a Senior Engineer – P3C Wire Bond Equipment Sustaining to ensure stability and performance of Wire Bond tooling in the P3C area. You will provide technical support to production, drive uptime, and lead improvements for reliability and quality.

The role requires hands-on Wire Bond sustaining experience, strong maintenance knowledge, and collaboration with cross-functional teams to resolve technical issues and execute root-cause analysis for recurring problems.

Qualifications

• Bachelor’s degree in Mechanical, Electrical, Electronics, Mechatronics, or related Engineering.
• Minimum 5 years of experience in semiconductor equipment engineering.
• Experience supporting Wire Bond equipment in a high-volume manufacturing environment.
• Hands-on experience in Wire Bond equipment sustaining and troubleshooting.
• Strong knowledge of equipment maintenance and reliability engineering principles.

Responsibilities

• Sustain and maintain Wire Bond equipment to meet production, quality, and reliability targets.
• Troubleshoot equipment failures and lead root cause analysis to prevent recurrence.
• Drive preventive, predictive, and corrective maintenance activities to maximize equipment uptime.
• Monitor and improve equipment performance metrics such as OEE, MTBF, and MTTR.
• Support equipment qualification, validation, and release for production.
• Work with Production, Process Engineering, Quality, and Maintenance teams to resolve issues.
• Lead equipment performance improvement initiatives to enhance productivity and reduce downtime.
• Collaborate with equipment suppliers on technical support, troubleshooting, and upgrades.
• Prepare and maintain equipment procedures, documentation, and technical reports.

Skills

Root cause analysis

Continuous improvement

Data analysis

Maintenance & reliability principles

Education

Bachelor's degree in Mechanical, Electrical, Electronics, Mechatronics, or related Engineering

Tools

SPC software

8D problem solving

CAPA processes

FMEA processes

Minitab

JMP

Job description

About the Role As a Senior Engineer – P3C Wire Bond (WB) Equipment Sustaining, you will be responsible for ensuring the stability, reliability, and performance of Wire Bond equipment within the P3C manufacturing area. You will provide technical support to production, drive equipment uptime, resolve equipment-related issues, and implement continuous improvement initiatives to achieve operational excellence.

What You Will Do

• Sustain and maintain Wire Bond equipment to meet production, quality, and reliability targets.


• Troubleshoot equipment failures and lead root cause analysis to prevent recurrence.


• Drive preventive, predictive, and corrective maintenance activities to maximize equipment uptime.


• Monitor and improve equipment performance metrics such as OEE, MTBF, and MTTR.


• Support equipment qualification, validation, and release for production.


• Work closely with Production, Process Engineering, Quality, and Maintenance teams to resolve technical issues.


• Lead equipment performance improvement initiatives to enhance productivity and reduce downtime.


• Collaborate with equipment suppliers on technical support, troubleshooting, and upgrades.


• Prepare and maintain equipment procedures, documentation, and technical reports.

What You Will Need

• Bachelor's Degree in Mechanical, Electrical, Electronics, Mechatronics, or related Engineering discipline.


• Minimum 5 years of experience in semiconductor equipment engineering.


• Experience supporting Wire Bond equipment in a high-volume manufacturing environment.


• Must Have Hands-on experience in Wire Bond equipment sustaining and troubleshooting.


• Strong knowledge of equipment maintenance and reliability engineering principles.


• Experience with root cause analysis and problem-solving methodologies.


• Knowledge of SPC, FMEA, 8D, CAPA, and continuous improvement tools.


• Experience in equipment qualification, validation, and process support.


• Good to Have Experience with ASM, K&S (Kulicke & Soffa), or Hesse Wire Bond equipment.


• Lean Six Sigma Green Belt certification.


• Knowledge of MES, Factory Automation, or Industry 4.0 technologies.


• Experience supporting NPI, equipment upgrades, or automation projects.


• Data analysis skills using Minitab, JMP, or equivalent tools.

D&I Statement As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested. In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030. Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 12,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.