Senior Wafer Bonding Process Engineer—NPI & R&D Leader

ams OSRAM; Kulim; On-site; MYR 180,000 - 240,000; Full time

Job summary

ams OSRAM Opto Semiconductors in Kulim is seeking an experienced professional to lead bonding process development for product and chip development projects. You will manage own process projects, design experiments, and generate clear technical reports documenting the results.

The role involves developing new tools and materials, optimizing processes from tool selection through production release, and driving improvements in collaboration with Process and Production teams.

Qualifications

• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an advantage.
• Strong understanding of wafer fabrication processes and bonding technologies.

Responsibilities

• Develop (or transfer from Regensburg) Bonding processes to support Product (Chip) Development projects; manage own process projects with clear timelines and reports.
• Develop new tools/processes; material development from tool selection through optimization to production release.
• Involve in new product introduction to ensure smooth ramp-up of new products.
• Interface between Process R&D Regensburg for new processes; act as expert for Bonding technologies; collaborate and standardize.

Skills

Bonding processes

Wafer bonding

Process development

NPI

Semiconductor

Education

Master's or PhD in Physics/Optics/Electrical Engineering/Materials Science

Job description

ams OSRAM Opto Semiconductors in Kulim is seeking an experienced professional to lead bonding process development for product and chip development projects. You will manage own process projects, design experiments, and generate clear technical reports documenting the results.

The role involves developing new tools and materials, optimizing processes from tool selection through production release, and driving improvements in collaboration with Process and Production teams.