Wafer Bonding Process Development Lead

Osram (Malaysia) Sdn Bhd; Kedah; Sur place; MYR 85 000 - 125 000; Plein temps

Résumé du poste

ams OSRAM is a global leader in light and sensor solutions, seeking a Process Development Engineer. You will drive bonding process development, enabling smooth transitions for new products and close collaboration with R&D Regensburg.

A strong background in wafer bonding and materials science is essential. The role emphasizes independent project leadership, experimental design, and clear technical reporting in a fast-paced semiconductor environment in Malaysia.

Qualifications

• Degree, Master's, or PhD in Physics, Optics, Electrical Engineering, Materials Science, or a related field.
• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an added advantage.
• Good understanding of wafer fabrication processes, semiconductor materials, and bonding technologies.
• Knowledge of relevant analytical and characterization methods.
• Strong communication, presentation, and teamwork skills.
• Analytical, creative, and able to work effectively in a fast-paced environment.
• Able to independently drive process development, new process introduction (NPI), and R&D activities.

Responsabilités

• Develop or transfer bonding processes to support the Product (Chip) Development projects and document results.
• Develop new tools/processes, material development from tool selection via process optimization to production release; design experiments.
• Involve in new product introduction to ensure smooth transition and ramp up of new products.
• Act as the key interface between Process R&D Regensburg for new processes and technologies, and be the expert for Bonding technologies.

Connaissances

Process development

NPI

Bonding technologies

Wafer bonding

Materials understanding

Analytical methods

Communication

Teamwork

Independent work

Formation

PhD in Physics

Master in Optics

Master in Electrical Engineering

Master in Materials Science

Description du poste

ams OSRAM is a global leader in light and sensor solutions, seeking a Process Development Engineer. You will drive bonding process development, enabling smooth transitions for new products and close collaboration with R&D Regensburg.

A strong background in wafer bonding and materials science is essential. The role emphasizes independent project leadership, experimental design, and clear technical reporting in a fast-paced semiconductor environment in Malaysia.