Wafer Bonding Process Development Senior Staff Engineer

OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang; Kulim; On-site; MYR 120,000 - 210,000; Full time

Job summary

OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang is seeking an experienced Bonding Process Engineer to lead development and transfer of bonding technologies for chip development projects.

The role focuses on independent process project management, design of experiments, and documentation. Deep knowledge of wafer bonding, metallization, and related materials is essential for successful product introductions and ramp-ups.

Qualifications

• Degree, Master’s, or PhD in Physics, Optics, Electrical Engineering, Materials Science, or a related field.
• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an added advantage.
• Good understanding of wafer fabrication processes, semiconductor materials, and bonding technologies.
• Knowledge of relevant analytical and characterization methods.
• Strong communication, presentation, and teamwork skills. Analytical, creative, and able to work effectively in a fast-paced environment.
• Able to independently drive process development, new process introduction (NPI), and R&D activities.

Responsibilities

• Develop (or transfer from Regensburg) Bonding processes to support the Product (Chip) Development projects. Manage own process projects independently and work on project closure as per timeline planned effectively, well-designed experiments and write clear, concise technical reports documenting the results.
• Key task is the development of new tool/ processes, material development from tool selection via process optimization to production release of new processes.
• Deep involvement on new product introduction to ensure smooth transition & ramp up of new products.
• Key interface between Process RnD Regensburg for new processes and technologies, be the expert for Bonding technologies, have a detailed market overview. Work on Collaboration and Standardization.

Skills

Project management

Bonding technologies

Wafer fabrication

Process development

NPI

Analytical methods

Communication

Teamwork

Education

Master's degree in Physics/Optics/EE/Materials Science

PhD in Physics/Optics/EE/Materials Science

Job description

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. "Sense the power of light" - our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends. Find out more about us on https://ams-osram.com

Your new responsibilities

• Develop (or transfer from Regensburg) Bonding processes to support the Product (Chip) Development projects. Manage own process projects independently and work on project closure as per timeline planned effectively, well-designed experiments and write clear, concise technical reports documenting the results.
• Key task is the development of new tool/ processes, material development from tool selection via process otimization to production release of new processes. Strong understanding of the interactions between process and hardwareis required. Cost optimization projects by process improvement, material saving are part of the function as well. Work closely with Process and Production department on improvement activities and drive for further improvements.
• Deep involvement on new product introduction to ensure smooth transition & ramp up of new products.
• Key interface between Process RnD Regensburg for new processes and technologies, be the expert for Bonding technologies, have a detailled market overview. Work on Collaboration and Standardization.

What we look for

• Degree, Master's, or PhD in Physics, Optics, Electrical Engineering, Materials Science, or a related field.
• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an added advantage.
• Good understanding of wafer fabrication processes, semiconductor materials, and bonding technologies.
• Knowledge of relevant analytical and characterization methods.
• Strong communication, presentation, and teamwork skills.Analytical, creative, and able to work effectively in a fast-paced environment.
• Able to independently drive process development, new process introduction (NPI), and R&D activities.