Process Development Senior Engineer (Die Attach / Wire Bond)

ams OSRAM; Bayan Lepas; On-site; MYR 90,000 - 150,000; Full time

Job summary

ams OSRAM Opto Semiconductors is seeking a Process Engineer to develop or optimize Die Attach and Wire Bond processes for new product development, ensuring targets for cost, quality and schedule are met. You will participate in technology roadmaps, support building block activities and equipment selection aligned with project goals.

You will also transfer know-how to Manufacturing, coach junior staff, and participate in engineering samples, pre-series and ramp-up builds to fulfill customer

Qualifications

• 2-3 years in semiconductor field especially in Die Attach and Wire Bond processes.
• Process engineering knowledge in semiconductors or LED manufacturing processes.
• Knowledge in process development step and statistics.
• Six Sigma Green Belt or Black Belt will be advantageous.

Responsibilities

• Develop or optimize Die Attach and Wire Bond processes for new product development projects to meet cost, quality and timeline targets.
• Participate and support FOL processes technology roadmap and building block activities.
• Equipment selection which meet project cost, quality and timeline target.
• Share and transfer technical know how within R&D and to Manufacturing team.
• Provide technical guidance or job coaching to junior supporting staff.
• Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.

Skills

Die Attach

Wire Bond

Process engineering

Statistical methods

Education

Bachelor/Master in Electrical/Electronics/Mechatronics/Mechanical Engineering or equivalent

Tools

Minitab

Job description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

• Develop or optimize Die Attach and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.
• Participate and support FOL processes tehcnology roadmap and building block activities.
• Equipment selection which meet project cost, quality and timeline target.
• Share and transfer technical know how within R&D and to Manufacturing team.
• Provide technical guidance or job coaching to junior supporting staff
• Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.

• Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
• 2-3 years in semiconductor field especially in Die Attach and Wire Bond processes.
• Process egnineering knowledge in semiconductors or LED manufacturing processes.
• Knowledge in process development step and statistic.
• B. Minitab knowledge will be advantage.
• Six Sigma Green or Black Belt will be advantage.