Lead Laser Dicing & Wafer Bonding Process Engineer

ams OSRAM; Kuala Lumpur; On-site; MYR 201,000 - 312,000; Full time

Job summary

ams OSRAM Opto Semiconductors seeks a senior process engineer to lead development and optimization of laser dicing, singulation, LLO, bonding, and wafer back grinding. You will drive FMEA-based risk management, CAPA actions, and cross-functional collaboration to ensure quality, yield, and throughput.

You will work with Equipment Engineers and NPI teams to align process capability with product specs, develop transition plans, and push continuous improvement across manufacturing sites in Malaysia

Qualifications

• 10+ years in manufacturing environment.
• 5+ years in dicing/ grinding/ LLO/ Bonding process engineering.
• Fluency in English and Bahasa Malaysia.

Responsibilities

• Lead process development and optimization for laser dicing, singulation, and related wafer processes to meet quality, yield, and throughput targets.
• Perform risk assessments (FMEA) to identify failure modes and implement controls ensuring product quality and audit readiness.
• Collaborate with Equipment Engineers, Product Integration, FPD, and NPI teams to align equipment capabilities with product specs.
• Drive continuous improvement to improve yield, reliability, and tool uptime for laser dicing, grinding, LLO, and wafer bonding.
• Develop and drive equipment strategy (CEPT/BEST) for critical processes and manage lifecycle from procurement specs to tool validation.
• Plan cross-functional activities to ensure stable production and alignment with long-term technology roadmaps.
• Lead CAPA activities and support customer/compliance audits for ISO standards.

Skills

Process development

Laser dicing

Wafer back grinding

Laser lift off (LLO)

Wafer bonding

FMEA & risk assessment

Quality systems

CAPA implementation

Cross-functional collaboration

ISO/TS 16949, ISO 45001, ISO 14001

Education

Degree / Master in EE / Mechatronic / Mechanical / Chemical Engineering

Job description

ams OSRAM Opto Semiconductors seeks a senior process engineer to lead development and optimization of laser dicing, singulation, LLO, bonding, and wafer back grinding. You will drive FMEA-based risk management, CAPA actions, and cross-functional collaboration to ensure quality, yield, and throughput.

You will work with Equipment Engineers and NPI teams to align process capability with product specs, develop transition plans, and push continuous improvement across manufacturing sites in Malaysia