Wafer Bonding Process Development Engineer / Senior Engineer

ams OSRAM; Kulim; Sur place; MYR 180 000 - 240 000; Plein temps

Résumé du poste

ams OSRAM Opto Semiconductors in Kulim is seeking an experienced professional to lead bonding process development for product and chip development projects. You will manage own process projects, design experiments, and generate clear technical reports documenting the results.

The role involves developing new tools and materials, optimizing processes from tool selection through production release, and driving improvements in collaboration with Process and Production teams.

Qualifications

• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an advantage.
• Strong understanding of wafer fabrication processes and bonding technologies.

Responsabilités

• Develop (or transfer from Regensburg) Bonding processes to support Product (Chip) Development projects; manage own process projects with clear timelines and reports.
• Develop new tools/processes; material development from tool selection through optimization to production release.
• Involve in new product introduction to ensure smooth ramp-up of new products.
• Interface between Process R&D Regensburg for new processes; act as expert for Bonding technologies; collaborate and standardize.

Connaissances

Bonding processes

Wafer bonding

Process development

NPI

Semiconductor

Formation

Master's or PhD in Physics/Optics/Electrical Engineering/Materials Science

Description du poste

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

• Develop (or transfer from Regensburg) Bonding processes to support the Product (Chip) Development projects. Manage own process projects independently and work on project closure as per timeline planned effectively, well-designed experiments and write clear, concise technical reports documenting the results.
• Key task is the development of new tool/ processes, material development from tool selection via process otimization to production release of new processes. Strong understanding of the interactions between process and hardwareis required. Cost optimization projects by process improvement, material saving are part of the function as well. Work closely with Process and Production department on improvement activities and drive for further improvements.
• Deep involvement on new product introduction to ensure smooth transition & ramp up of new products.
• Key interface between Process RnD Regensburg for new processes and technologies, be the expert for Bonding technologies, have a detailled market overview. Work on Collaboration and Standardization.

• Degree, Master's, or PhD in Physics, Optics, Electrical Engineering, Materials Science, or a related field.
• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an added advantage.
• Good understanding of wafer fabrication processes, semiconductor materials, and bonding technologies.
• Knowledge of relevant analytical and characterization methods.
• Strong communication, presentation, and teamwork skills.Analytical, creative, and able to work effectively in a fast-paced environment.
• Able to independently drive process development, new process introduction (NPI), and R&D activities.