Senior Wafer Bonding Process Development Engineer

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Kedah; On-site; MYR 180,000 - 300,000; Full time

Job summary

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd is seeking a Wafer Bonding Process Development Senior Staff Engineer in Kedah. The role focuses on developing and transferring bonding processes to support chip development, managing projects independently, and delivering well-designed experiments with clear technical reports.

You will drive tool and material development from selection to production release, collaborate with Process and Production teams, and contribute to new product introductions and

Qualifications

• Degree, Master's, or PhD in Physics, Optics, Electrical Engineering, Materials Science, or a related field.
• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an added advantage.
• Good understanding of wafer fabrication processes, semiconductor materials, and bonding technologies.
• Knowledge of relevant analytical and characterization methods.
• Strong communication, presentation, and teamwork skills.
• Able to independently drive process development, new process introduction (NPI), and R&D activities.

Responsibilities

• Develop (or transfer from Regensburg) Bonding processes to support Product (Chip) Development projects.
• Manage own process projects independently and work on project closure as per timeline planned.
• Design experiments and write clear, concise technical reports documenting results.
• Develop new tools/ processes and material development from tool selection to production release.
• Drive cost optimization through process improvements and material saving.
• Work closely with Process and Production departments on improvement activities.
• Lead NPI and ramp-up during new product introductions.
• Act as the interface between Process R&D Regensburg for new processes and technologies.

Skills

Wafer bonding

Metallization processes

Analytical methods

Strong communication

Teamwork

Education

Degree/Master/PhD in Physics, Optics, Electrical Engineering, Materials Science

Tools

Wafer bonding equipment

Characterization tools

Job description

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd is seeking a Wafer Bonding Process Development Senior Staff Engineer in Kedah. The role focuses on developing and transferring bonding processes to support chip development, managing projects independently, and delivering well-designed experiments with clear technical reports.

You will drive tool and material development from selection to production release, collaborate with Process and Production teams, and contribute to new product introductions and