Senior Wafer Bonding Process Engineer (NPI & R&D)

Ams Osram

Kulim

On-site

MYR 90,000 - 150,000

Full time

14 days+

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Job summary

ams OSRAM Opto Semiconductors in Kulim, Malaysia, seeks an experienced engineer to advance bonding and metallization technologies for chip development. The role emphasizes independent process development and transfer from Regensburg, with drive for NPI and production readiness.

You will collaborate with Process and Production teams, design experiments, document results, and deliver clear technical reports. A Master/PhD in Physics, Optics, or Materials Science with 5+ years in semiconductors is

Qualifications

Degree, Master’s, or PhD in Physics, Optics, Electrical Engineering, Materials Science, or a related field.
Minimum 5 years of experience in the semiconductor industry.
Experience in wafer bonding and/or metallization processes is an added advantage.

Responsibilities

Develop (or transfer from Regensburg) bonding processes for product (chip) development projects and manage own process projects with timely closure.
Develop new tool/process and drive from tool selection to production release; design experiments and document results.
Lead deep involvement in new product introduction to ensure smooth ramp-up and collaborate with Process R&D Regensburg on new processes and technologies.