Wafer Bonding Process Development Senior Staff Engineer

Ams Osram; Kulim; On-site; MYR 90,000 - 150,000; Full time

Job summary

ams OSRAM Opto Semiconductors in Kulim, Malaysia, seeks an experienced engineer to advance bonding and metallization technologies for chip development. The role emphasizes independent process development and transfer from Regensburg, with drive for NPI and production readiness.

You will collaborate with Process and Production teams, design experiments, document results, and deliver clear technical reports. A Master/PhD in Physics, Optics, or Materials Science with 5+ years in semiconductors is

Qualifications

• Degree, Master’s, or PhD in Physics, Optics, Electrical Engineering, Materials Science, or a related field.
• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an added advantage.

Responsibilities

• Develop (or transfer from Regensburg) bonding processes for product (chip) development projects and manage own process projects with timely closure.
• Develop new tool/process and drive from tool selection to production release; design experiments and document results.
• Lead deep involvement in new product introduction to ensure smooth ramp-up and collaborate with Process R&D Regensburg on new processes and technologies.

Skills

Bonding technologies

Wafer bonding

Wafer metallization

Process development

NPI / R&D

Analytical methods

Communication

Teamwork

Education

Physics / Optics / Electrical Engineering / Materials Science (Degree, Master’s, or PhD)

Job description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

• Develop (or transfer from Regensburg) Bonding processes to support the Product (Chip) Development projects. Manage own process projects independently and work on project closure as per timeline planned effectively, well-designed experiments and write clear, concise technical reports documenting the results.
• Key task is the development of new tool/ processes, material development from tool selection via process otimization to production release of new processes. Strong understanding of the interactions between process and hardwareis required. Cost optimization projects by process improvement, material saving are part of the function as well. Work closely with Process and Production department on improvement activities and drive for further improvements.
• Deep involvement on new product introduction to ensure smooth transition & ramp up of new products.
• Key interface between Process RnD Regensburg for new processes and technologies, be the expert for Bonding technologies, have a detailled market overview. Work on Collaboration and Standardization.

• Degree, Master's, or PhD in Physics, Optics, Electrical Engineering, Materials Science, or a related field.
• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an added advantage.
• Good understanding of wafer fabrication processes, semiconductor materials, and bonding technologies.
• Knowledge of relevant analytical and characterization methods.
• Strong communication, presentation, and teamwork skills.Analytical, creative, and able to work effectively in a fast-paced environment.
• Able to independently drive process development, new process introduction (NPI), and R&D activities.