Senior Wafer Bonding Process Development Engineer

Ams Osram; Kuala Lumpur; On-site; MYR 120,000 - 180,000; Full time

Job summary

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The role focuses on developing and transferring bonding processes, driving NPI, and coordinating with Process R&D Regensburg to ensure timely production releases.

Candidates should have 5+ years in the semiconductor industry with a strong background in wafer bonding and metallization, solid

Qualifications

• Bachelor’s/Master’s/PhD in Physics, Optics, Electrical Engineering, Materials Science, or related field.
• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an added advantage.
• Good understanding of wafer fabrication processes, semiconductor materials, and bonding technologies.
• Knowledge of relevant analytical and characterization methods.
• Strong communication, presentation, and teamwork skills.
• Analytical, creative, and able to work effectively in a fast-paced environment.
• Able to independently drive process development, new process introduction (NPI), and R&D activities.

Responsibilities

• Develop (or transfer from Regensburg) bonding processes to support product development projects and manage own process projects.
• Develop new tools/ processes from tool selection to production release, with design of experiments and clear reports.
• Deep involvement on new product introduction to ensure smooth transition and ramp-up of new products.
• Act as the key interface between Process R&D Regensburg for new processes/ technologies and drive standardization.

Skills

Process development

NPI

Teamwork

Communication

Analytical thinking

Creative thinking

Project management

Education

Master’s or PhD in Physics/Optics/Electrical Engineering/Materials Science

Tools

Wafer bonding equipment

Metallization processes

Job description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The role focuses on developing and transferring bonding processes, driving NPI, and coordinating with Process R&D Regensburg to ensure timely production releases.

Candidates should have 5+ years in the semiconductor industry with a strong background in wafer bonding and metallization, solid