Wafer Bonding Process Development Senior Staff Engineer

Ams Osram; Kuala Lumpur; On-site; MYR 120,000 - 180,000; Full time

Job summary

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The role focuses on developing and transferring bonding processes, driving NPI, and coordinating with Process R&D Regensburg to ensure timely production releases.

Candidates should have 5+ years in the semiconductor industry with a strong background in wafer bonding and metallization, solid

Qualifications

• Bachelor’s/Master’s/PhD in Physics, Optics, Electrical Engineering, Materials Science, or related field.
• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an added advantage.
• Good understanding of wafer fabrication processes, semiconductor materials, and bonding technologies.
• Knowledge of relevant analytical and characterization methods.
• Strong communication, presentation, and teamwork skills.
• Analytical, creative, and able to work effectively in a fast-paced environment.
• Able to independently drive process development, new process introduction (NPI), and R&D activities.

Responsibilities

• Develop (or transfer from Regensburg) bonding processes to support product development projects and manage own process projects.
• Develop new tools/ processes from tool selection to production release, with design of experiments and clear reports.
• Deep involvement on new product introduction to ensure smooth transition and ramp-up of new products.
• Act as the key interface between Process R&D Regensburg for new processes/ technologies and drive standardization.

Skills

Process development

NPI

Teamwork

Communication

Analytical thinking

Creative thinking

Project management

Education

Master’s or PhD in Physics/Optics/Electrical Engineering/Materials Science

Tools

Wafer bonding equipment

Metallization processes

Job description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

• Develop (or transfer from Regensburg) Bonding processes to support the Product (Chip) Development projects. Manage own process projects independently and work on project closure as per timeline planned effectively, well-designed experiments and write clear, concise technical reports documenting the results.
• Key task is the development of new tool/ processes, material development from tool selection via process otimization to production release of new processes. Strong understanding of the interactions between process and hardwareis required. Cost optimization projects by process improvement, material saving are part of the function as well. Work closely with Process and Production department on improvement activities and drive for further improvements.
• Deep involvement on new product introduction to ensure smooth transition & ramp up of new products.
• Key interface between Process RnD Regensburg for new processes and technologies, be the expert for Bonding technologies, have a detailled market overview. Work on Collaboration and Standardization.

• Degree, Master's, or PhD in Physics, Optics, Electrical Engineering, Materials Science, or a related field.
• Minimum 5 years of experience in the semiconductor industry.
• Experience in wafer bonding and/or metallization processes is an added advantage.
• Good understanding of wafer fabrication processes, semiconductor materials, and bonding technologies.
• Knowledge of relevant analytical and characterization methods.
• Strong communication, presentation, and teamwork skills.Analytical, creative, and able to work effectively in a fast-paced environment.
• Able to independently drive process development, new process introduction (NPI), and R&D activities.