FOL Development Staff Engineer

Carsem; Ipoh; On-site; MYR 120,000 - 180,000; Full time

Job summary

Carsem is seeking a senior engineer to lead end-to-end design and development of high-power discrete and power module packages. Translate customer requirements into PRS and SCD, and collaborate with design, materials and process teams to define optimized packaging structures and assembly flows.

The role also involves applying DFM principles, developing DFMEA/PFMEA and control plans, and overseeing electrical, thermal, and reliability characterization and qualification activities as part of NPI

Qualifications

• At least 5 years of experience in high-power discrete or power module packaging development.
• Proven track record in leading NPI projects from concept through HVM transfer.
• In-depth knowledge of FOL (Front-of-Line) processes including SiC wafer dicing, solder reflow and gel-fill modules.

Responsibilities

• Lead end-to-end design and development of high-power discrete and power module packages.
• Translate customer requirements into Package Requirement Specifications (PRS) and Supplier Component Documents (SCD).
• Collaborate with design, materials, and process teams to define optimized package structures and assembly flows.

Job description

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Lead the end-to-end design and development of high-power discrete and power module packages.

Translate customer requirements into Package Requirement Specifications (PRS) and Supplier Component Documents (SCD).

Collaborate with design, materials, and process teams to define optimized package structures and assembly flows.

Apply Design for Manufacturability (DFM) principles to ensure robust production, cost control, and quality compliance.

Develop and maintain technical documentation including DFMEA, PFMEA, QFD, LAR plans, control plans, and procurement specifications.

Oversee electrical, thermal, and reliability characterization and qualification activities.

Contribute to the development and maintenance of the Wide Bandgap (WBG) packaging technology roadmap.

New Product Introduction (NPI) Project Management

Manage complete NPI project timelines, deliverables, and risk mitigation activities.

Lead prototyping, proof-of-concept builds, qualification runs, and transition to high-volume manufacturing (HVM).

Conduct technical design reviews and lead phase gate execution.

Collaborate with Business Units (BU), QA, manufacturing, and application teams to ensure aligned project execution.

Use structured problem-solving methods such as 8D and RCCA for resolving design and process challenges.

Ensure compliance with internal NPI frameworks and customer-specific milestones.

Leadership & Technical Influence

Mentor junior engineers and foster a strong, innovation-driven technical culture.

Contribute to continuous improvement initiatives and share best practices across cross-functional teams.

Support customer audits and lead technical discussions during product qualification phases.

Power Package & Module Development

• Lead the end-to-end design and development of high-power discrete and power module packages.

• Translate customer requirements into Package Requirement Specifications (PRS) and Supplier Component Documents (SCD).

• Collaborate with design, materials, and process teams to define optimized package structures and assembly flows.

• Apply Design for Manufacturability (DFM) principles to ensure robust production, cost control, and quality compliance.

• Develop and maintain technical documentation including DFMEA, PFMEA, QFD, LAR plans, control plans, and procurement specifications.

• Oversee electrical, thermal, and reliability characterization and qualification activities.

• Contribute to the development and maintenance of the Wide Bandgap (WBG) packaging technology roadmap.

New Product Introduction (NPI) Project Management

• Manage complete NPI project timelines, deliverables, and risk mitigation activities.

• Lead prototyping, proof-of-concept builds, qualification runs, and transition to high-volume manufacturing (HVM).

• Conduct technical design reviews and lead phase gate execution.

• Collaborate with Business Units (BU), QA, manufacturing, and application teams to ensure aligned project execution.

• Use structured problem-solving methods such as 8D and RCCA for resolving design and process challenges.

• Ensure compliance with internal NPI frameworks and customer-specific milestones.

Leadership & Technical Influence

• Mentor junior engineers and foster a strong, innovation-driven technical culture.

• Contribute to continuous improvement initiatives and share best practices across cross-functional teams.

• Support customer audits and lead technical discussions during product qualification phases.

Bachelor’s or Master’s Degree in Mechanical, Electrical, Materials Engineering, or a related field.

At least 5 years of experience in high-power discrete or power module packaging development.

Proven track record in leading NPI projects from concept through HVM transfer.

In-depth knowledge of FOL (Front-of-Line) processes, including:

• SiC wafer dicing
• Solder reflow and gel-fill modules
• Thermal and electrical design optimization

Familiarity with JEDEC, AEC-Q100, and relevant reliability standards.

Bachelor’s or Master’s Degree in Mechanical, Electrical, Materials Engineering, or a related field.

At least 5 years of experience in high-power discrete or power module packaging development.

Proven track record in leading NPI projects from concept through HVM transfer.

In-depth knowledge of FOL (Front-of-Line) processes, including:

• SiC wafer dicing
• Heated die attach (DA)
• Cu/Ag wire/ribbon bonding
• Solder reflow and gel-fill modules
• Thermal and electrical design optimization

Familiarity with JEDEC, AEC-Q100, and relevant reliability standards.

Technical Expertise

Power package design and device-package interaction

Material selection and reliability testing

Alignment with Wide Bandgap (WBG) packaging roadmaps

Analytical Tools & Software

AutoCAD, JMP, Minitab

Microsoft Excel, PowerPoint, and technical report writing

Strong skills in NPI planning, risk-based thinking, and milestone tracking

Clear communication across departments and with customers

Ability to influence and lead in cross-functional technical discussions

Problem Solving & Innovation

Proficient in 8D, RCCA for root cause analysis