Subcontract Manufacturing Engineer

Wolfspeed; Ipoh; On-site; MYR 180,000 - 240,000; Full time

Job summary

Wolfspeed in Ipoh, Malaysia is seeking an experienced supply chain professional to manage backend packaging subcontractors, drive throughput improvements, and support subcontractor selection and new product introductions.

You will lead qualification plans from cradle to grave, resolve technical issues across Field, Manufacturing and supply chain, and maintain proactive communication to Wolfspeed stakeholders while ensuring BOM changes and specifications are accurately managed.

Qualifications

• Bachelor degree in science, engineering or related field; equivalent experience.
• Minimum of five years in semiconductor packaging operations.
• Six Sigma Green Belt (Black Belt desired) or equivalent experience.
• Experience with backend semiconductor processes and qualification plans.
• Ability to participate in weekly global conference calls with Wolfspeed US operations.

Responsibilities

• Oversee operational management of assigned subcontractors in back-end packaging supply chain.
• Support subcontractor selection and new product introductions.
• Manage change control of bills of materials in the supply base.
• Coordinate technical issue resolution across Field, Manufacturing and supply chain.
• Maintain ongoing communication with subcontractors to resolve quality, process, and delivery issues.
• Perform other duties as assigned.

Skills

Semiconductor packaging operations

Structured problem solving

Cross-functional collaboration

MS Word / Excel / PowerPoint

Quality issue resolution

Education

Bachelor of Science in Science, Engineering, or related field

Master's in Operations Management (desirable)

Tools

MS Word

MS Excel

PowerPoint

Email systems

Job description

• Responsible for the complete operational management of assigned subcontractor(s) in the back-end packaging Supply Chain, including supporting the subcontractor selection process, the introduction of new products to the subcontractors, managing change control of bill of materials in the supply base, distribution and interpretation of specifications and drawings, and assurance that all requirements are met by the subcontractor throughout their processes and when received at Wolfspeed.
• Supports manufacturing for production and engineering lots and works to optimize throughput and cycle-time through subcontractor.
• Assists in creation and driving approval of technical product and process qualification plans. Manages qualification plans from cradle to grave; from planning to generation of samples to component level through final product level testing. Responsible for technical data driven recommendation based on results of qualification plan.
• Facilitates the resolution of module subcontractor related technical issues within products, whether discovered in the Field, in Manufacturing, or at the subcontractors or their supply chain.
• Maintains continuous communication with subcontractors to address and resolve quality, process, test, and delivery issues in real time and reports status of problem resolution to Wolfspeed stakeholders and management on a regular and timely basis.
• Performs other duties as assigned.

Requirements

• Bachelor of Science degree in Science, Engineering, or related field OR equivalent combination of education and experience.
• Minimum of five (5) years of experience in semiconductor packaging operations, including semiconductor back-end subcontract management.
• Six Sigma Green Belt (Black Belt Desired) or equivalent experience.
• Structured Problem Solving Training or equivalent experience.
• Direct functional expertise with backend semiconductor processes.
• Ability to participate in weekly pre- or post- core work hours conference calls with Wolfspeed US operations and production planning
• Ability to use MS Word, Excel, PowerPoint, and electronic e-mail systems proficiently.

Desired Skills

• Master's of Science, Engineering or Graduate Degree in Operations Management, or equivalent
• Knowledge of operating characteristics of power semiconductor devices and familiarity with industry standard power semiconductor packages.
• Experience with Power Semiconductor devices such as Half-Bridge Power Module assembly processes from die pick & place, Wire Bond, molding, DBCs to base plate attachment, reflow profiling, gel fill, casing assembly, electrical testing etc.
• Engineer with actual experience who can support and drive all activities related to Power modules devices.
• Excellent written and verbal communication skills.
• Credible communication when interacting with Wolfspeed customer supply chain engineers and management.
• Ability to translate, statistically analyze data, and effectively report problems through written and/or graphical formats.
• Experienced in working with senior level management, both internally and externally.
• Ability to work independently, including preparing and delivering presentations, participation in purchasing negotiations as technical support, negotiating specifications and process requirements.
• Experience leading cross functional teams in problem solving or process development efforts.
• Able to work cross functionally with personnel from various organizations - Operations, Engineering, Product Development, QA, Production Planning and Procurement etc…
• Attention to details.