IC Assembly/Subcon Engineer

Efinix Technology (M) Sdn. Bhd.; Bayan Lepas; On-site; MYR 60,000 - 90,000; Full time

Job summary

Efinix Technology (M) Sdn. Bhd. is seeking a Backend Sustaining Engineer to drive assembly and test backend activities at OSAT sites. You will track yield and performance, develop backend specs, and manage MRB/deviations.

The role requires a bachelor’s in science/engineering and at least 3 years in semiconductors, with good English, IC package knowledge, and FA/SPC/FMEA/JESDEC familiarity. Travel domestically and internationally to OSAT partners is expected.

Qualifications

• Bachelor’s degree in science or engineering discipline.
• Minimum 3 years of semiconductor experience.
• Proficient in English (spoken and written).
• Good knowledge of IC Assembly (FOL/EOL).
• Understanding of IC packages (BGA/Flip Chip/WLCSP/Leaded).
• Familiar with FA, SPC, FMEA, and JEDEC standards.
• Strong coordination, tracking and follow-up of issues and projects.
• Able to communicate across all levels and be a team player.
• Willing to travel domestically and internationally to OSAT partners.
• Experience/knowledge on wafer process, ATE tester 1st level debugging and data analysis is a plus.

Responsibilities

• Support backend assembly and test sustaining activities at OSAT sites.
• Track yield, performance and report findings for backend.
• Develop and maintain backend specs and documentation.
• Manage MRB and deviations for backend materials.
• Drive continuous improvement programs at OSAT.
• Support customer and supplier audits at assembly partner sites.
• Collaborate on failure analysis and reliability at partners.
• Contribute to NPI, qualification and bring-up at partners.

Skills

English proficiency

Coordination skills

Problem solving

Communication skills

Team player

Education

Bachelor’s degree in science or engineering

Tools

FA (Failure Analysis)

SPC

FMEA

JEDEC standards

Job description

Responsible for Assembly and Test Backend Sustaining Engineering activities at all OSAT’s site.

Responsible for Assembly and Test Backend yield and performance tracking and reporting.

Develop and maintain Assembly and Test Backend-related specs and documentation.

Responsible for Assembly and Test Backend Material Review Board (MRB) and deviation management.

Drive continuous improvement program at OSAT.

Support customer audit and supplier audit at assembly partners’ site.

Collaborate with Quality Engineer on failure analysis and reliability-related activities with assembly partners.

Contribute to cross-functional activities of NPI, product qualification and product bring-up at assembly partners’ site.

Requirements:

Bachelor’s Degree in Science or Engineering discipline (Mechanical, Electronics, Physics, Chemistry, Material or related field).

3 years of semiconductor experience is a must for this position

Good command of English in both speaking and writing.

Good process knowledge about IC Assembly (FOL/EOL).

Good understanding on IC packages (BGA/Flipchip /WLCSP/Leaded).

Good understanding of Failure Analysis (FA), SPC (Statistical Process Control), FMEA (Failure Mode and Effects Analysis), and JEDEC standards.

Good coordination, tracking and follow up skills on issues and projects.

Good ability to solve problems with logical approach and good analytical skills.

Ability to communicate with people at all levels, good working attitude and team player.

Willingness to travel domestically and internationally to OSAT partner sites.

Experience/knowledge on wafer process, ATE tester 1st level debugging and statistical data analysis will be added advantage.