Senior Package Technology Lead – OSAT Platform & Innovation

Infineon Technologies; Penang; On-site; MYR 180,000 - 300,000; Full time

Job description

Responsibilities

• Lead and participate in outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet time‑to‑market, product quality, process capability, and assembly yield targets.
• Define package definition tasks in the OSAT segment, including project complexity definition with Delta assessment list, project category assessment, and project risk assessment with mitigation actions.
• Integrate unit processes until process freeze for assembly and test at subcons, creating assembly specifications, marking instructions, and packing specifications for upload into the database.
• Apply and verify design rules based on established baseline documents and specific equipment and process capability of assembly sites; support OSAT technical capability assessment.
• Define process and select Bill of Material as needed to meet MSL, reliability level, and other specific package requirements for development and pre‑development.
• Enable new package platforms and derivative packages, supporting technology and package development at OSAT, including new subcon enabling support.
• Act as a driver or co‑driver for platform‑related task force activities and drive technical problem‑solving.

Qualifications and Skills

• Master’s or Bachelor’s degree in an engineering discipline.
• Minimum 10 years of experience in package development in new product introduction or process (Pre‑assembly, assembly, and test) and at least 3 years in supporting project management.
• Experience with module assembly, wafer‑level package (WLP), bumping, eWLB, and System in Package (SiP) is highly advantageous.
• Good knowledge of processes and materials for both laminate and lead frame packages and ability to interact with design, design rules, and process functions.
• Strong understanding of quality requirements and release criteria (e.g., JEDEC/AEC grades) that align with product/package design and BOM selection.
• Strong analytical skills, problem‑solving ability, and a commitment to high quality standards.
• Active knowledge transfer and best‑practice sharing across organizational boundaries; ambitious and able to make timely decisions.
• Highly motivated, able to prioritize and perform under pressure, and capable of motivating and involving team members and stakeholders.
• Collaborative teamwork skills with various stakeholders and partners in multi‑site and multi‑cultural teams.
• Strong communication and interpersonal skills at all levels; experience in subcontractor management.