ENGR STAFF, PROCESS; PKG&ASSY

onsemi; Seremban; On-site; MYR 235,849 - 314,465; Full time

Job summary

onsemi is looking for a skilled individual with over 8 years of experience in package technology development to lead new module development initiatives. The ideal candidate should have in-depth knowledge of power module packages and strong communication skills to effectively collaborate with teams. Responsibilities include ensuring adherence to technical requirements and driving problem-solving methodologies. A BS or MS degree is required, alongside proficiency in statistical software, Auto-CAD, and MS Office.

Qualifications

• 8+ years in package development.
• Experienced with power module package development.
• Self-motivated and open-minded with effective communication.

Responsibilities

• New package technology and module development.
• Ensure adherence to technical and quality requirements.
• Drive problem-solving methodology with risk assessment.

Skills

Package development

English communication

Statistical software (JMP, Minitab)

Auto-CAD

MS Office

Education

BS or MS degree

Job description

Job Summary

• New Package Technology and New Platform Module Development
• Responsible for new package/technology development following Advanced Product Qualification Plan (APQP).
• Good understanding of MRS and generate PRS with SCD definition.
• Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.
• Familiar with DFM, to secure robust manufacturability with quality requirements.
• Good understanding of power module package design rule, design rule update with new platform development.
• Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, etc.).
• Drive problem solving methodology with risk assessment to find technical issue and provide systematic solution.
• Strong knowledge and in-depth understanding of device-package interaction.
• Effectively working with team for on time development.
• Technical Project Management and Communication
• Responsible for defining and ensuring adherence based on technical requirement, quality requirement, project timing and cost.
• Strong communication with team for technical issue and problem solving, provide the improvement timeline with RCCA definition.
• Supporting to track and remind team members for tasks, deliverables, milestones of projects, successfully work with PM to be developed on time.
• Participate in all project/gate review, alignment with team.

Qualifications

• 8+ years in package development.
• Experienced areas: Power module package (pkg sintering / pkg soldering) development, B2S / B6S experience is plus.
• Experienced packages: Power module package (pkg sintering / pkg soldering)
• Education: BS or MS degree.
• Skills: Fluent with English communication, familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (ppt presentation).
• Personal characteristics: self-motivated, independent, open mind to communicate, willing to take risk and managing.