External Contractor - Advanced Package Design Engineer

Career Wise; Bayan Lepas; On-site; MYR 140,000 - 180,000; Full time

Job summary

A leading engineering consultancy is seeking an External Contractor - Advanced Package Design Engineer in Penang, Malaysia. The role requires a Bachelors or Masters in Electronics, with a minimum of 5 years in the semiconductor industry. Candidates should have laminate physical layout experience and strong communication skills. Responsibilities involve feasibility studies, design reviews, and drafting support. The ideal candidate has knowledge of design tools like Cadence and ANSYS, along with solid Signal Integrity fundamentals.

Qualifications

• At least 5 years of experience in the semiconductor industry.
• Laminate physical layout experience with simulation capability.
• Knowledge of Electromagnetics and transmission line theory.
• Hands-on experience with design and/or simulation tools: Cadence, ANSYS, Mentor, AutoCAD, ADS, Spice.
• Strong communication and interpersonal skills; able to work independently or in a team.

Responsibilities

• Conduct feasibility studies and design reviews for various packages.
• Perform physical layout and electrical analysis for successful tape out.
• Update design rules and DFMEA.
• Support drafting activities for substrate unit drawings and submissions.
• Participate in supplier qualification activities.

Skills

Electronics Engineering

Signal Integrity knowledge

Interpersonal skills

Teamwork

Communication and interpersonal skills

Independent work capability

Education

Bachelors/Masters in Electronics or related field

Tools

Cadence

ANSYS

Mentor

AutoCAD

ADS

Spice

Job description

External Contractor - Advanced Package Design Engineer

Job Title: External Contractor - Advanced Package Design Engineer

Requirements / Experience

• Bachelors/Masters degree in Electronics, Electrical, Microelectronics or other related Engineering field.
• At least 5 years of related working experience in semiconductor industry.
• Laminate physical layout experience equipped with signal/power integrity knowledge and simulation capability.
• Hands on experience using Design and/or Simulation Tools (Cadence, ANSYS, Mentor, AutoCAD, ADS, Spice, or any relevant).
• Good knowledge of Signal Integrity fundamentals including Electromagnetics, transmission line theory and S-parameters will be considered a major asset.
• Strong communication and interpersonal skills.
• Ability to work productively independently and in a team environment.

Job Descriptions / Responsibilities

• Responsible for WLCSP/WLBGA, eWLB package, Wirebond package & Flipchip package feasibility study, design & design review with OSAT & substrate suppliers.
• Perform laminate substrate physical layout and electrical analysis for success design tape out.
• Perform design rules and DFMEA update.
• Support drafting activities for substrate unit drawing, strip drawing, bond master & bonding diagram creation, update and submission in system.
• Participate in 2nd source supplier qualification activities (this is updated requirement for this position).

Note: All applicants must meet the minimum qualifications listed above to be considered for this external contractor role.