Senior Staff Process Engineer (LLO, Wafer Bonding & Grinding, Laser Dicing)

ams-OSRAM AG; Kulim; Presencial; MYR 180.000 - 240.000; Jornada completa

Descripción de la vacante

ams-OSRAM AG in Kulim, Malaysia seeks a senior Process Engineer to lead, develop and optimize the dicing and grinding processes, ensuring robust control with SPC and Line of Defense. You will work with process and equipment engineers to understand capabilities and drive improvements.

Responsibilities include performing FMEA risk assessments, creating documentation and compliance of procedures, implementing corrective and preventive actions, and coordinating with cross-site teams to align

Formación

• Degree/Master in the listed engineering fields
• Minimum 10 years manufacturing experience
• Minimum 5 years in dicing/grinding process engineering

Responsabilidades

• Lead, develop and optimize dicing/grinding processes with SPC and LOD controls
• Perform risk assessment using FMEA and derive controls
• Collaborate with Process & Equipment engineers to understand capabilities
• Drive continuous improvement to reduce waste and increase line uptime
• Coordinate with cross-site teams to synchronize process changes and equipment strategy
• Lead root-cause investigations and implement corrective actions

Conocimientos

SPC

FMEA

Continuous improvement

Documentation

Root cause analysis

Educación

Degree / Master in Electrical & Electronics / Mechatronic / Mechanical / Chemical Engineering

Herramientas

Poka-Yoke

Descripción del empleo

• Lead, develop and optimize dicing/ grinding process to ensure robustness of processes with Line of Defense (LOD), Statistical Process Control (SPC) etc control in place.


• To perform risk assessment using FMEA and derive control when needed. Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to quality standard & customer requirements.


• Interaction with Process & Equipment engineer to understand the Process & Equipment capability that influence towards the processes. To work with Product Integration Engineer/FPD/NPI to understand the product integration and process.


• Drive for continuous improvement initiatives to reduce waste, increase tool up time efficiency and improve quality for dicing/ gridining area.


• Collaborate with RBG counterparts to ensure both sites process changes is synchronized and develop future equipment strategy (CEPT/BEST) for dicing / grinding area which included procurement spec for equipment purchase, tool design improvement/PokaYoke, planning & execution within area of responsibility to support manufacturing activities.


• Leads engineering efforts in support of the root cause identification of non-conformances. Will take ownership of implementing corrective and preventive action.

Requirements:

• Degree / Master in Electrical & Electronics / Mechatronic / Mechanical / Chemical Engineering


• Min. 10 years experience in manufacturing environment


• Min. 5 years experience in dicing/ grinding process engineering