Senior Staff Process Engineer (LLO, Wafer Bonding & Grinding, Laser Dicing)

ams OSRAM; Kuala Lumpur; On-site; MYR 201,000 - 312,000; Full time

Job summary

ams OSRAM Opto Semiconductors seeks a senior process engineer to lead development and optimization of laser dicing, singulation, LLO, bonding, and wafer back grinding. You will drive FMEA-based risk management, CAPA actions, and cross-functional collaboration to ensure quality, yield, and throughput.

You will work with Equipment Engineers and NPI teams to align process capability with product specs, develop transition plans, and push continuous improvement across manufacturing sites in Malaysia

Qualifications

• 10+ years in manufacturing environment.
• 5+ years in dicing/ grinding/ LLO/ Bonding process engineering.
• Fluency in English and Bahasa Malaysia.

Responsibilities

• Lead process development and optimization for laser dicing, singulation, and related wafer processes to meet quality, yield, and throughput targets.
• Perform risk assessments (FMEA) to identify failure modes and implement controls ensuring product quality and audit readiness.
• Collaborate with Equipment Engineers, Product Integration, FPD, and NPI teams to align equipment capabilities with product specs.
• Drive continuous improvement to improve yield, reliability, and tool uptime for laser dicing, grinding, LLO, and wafer bonding.
• Develop and drive equipment strategy (CEPT/BEST) for critical processes and manage lifecycle from procurement specs to tool validation.
• Plan cross-functional activities to ensure stable production and alignment with long-term technology roadmaps.
• Lead CAPA activities and support customer/compliance audits for ISO standards.

Skills

Process development

Laser dicing

Wafer back grinding

Laser lift off (LLO)

Wafer bonding

FMEA & risk assessment

Quality systems

CAPA implementation

Cross-functional collaboration

ISO/TS 16949, ISO 45001, ISO 14001

Education

Degree / Master in EE / Mechatronic / Mechanical / Chemical Engineering

Job description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

• Lead process development and optimization for laser dicing & singulation/ wafer back grinding / laser lift off (LLO)/ wafer bonding. Define and optimize process parameter to meet quality, yield, and throughput target. Ensured process robustness through implementation of LOD, SPC, and advanced control strategies. Improved process stability and reduced variation through data-driven analysis and continuous monitoring
• Perform risk assessments using FMEA (Failure Mode and Effects Analysis) to identify potential failure modes, evaluate risks, and implement appropriate control measures to mitigate them. Establish, review, and maintain process controls and mitigation plans to ensure product quality, process stability, and compliance with operational standards. Ensure all processes and documentation meet quality standards, regulatory requirements, and customer specifications, supporting audit readiness and continuous compliance.
• Engage closely with Equipment Engineers to gain a deep understanding of process and equipment capabilities, and evaluate their impact on overall manufacturing processes and performance. Collaborate with Product Integration, FPD, and NPI teams to understand product requirements, integration flows, and process interactions, ensuring alignment between equipment capability and product specifications. Drive continuous improvement initiatives, focusing on tool design enhancements and implementation of Poka-Yoke (error-proofing) solutions to improve yield, reliability, operational efficiency and tool up time efficiency for laser dicing/ wafer grinding / Laser lif Off/ wafer bonding.
• Collaborate closely with RBG (Regional/Remote Business Group) counterparts to ensure synchronization of process changes and seamless implementation across both sites. Develop and drive future equipment strategy (CEPT/BEST) for critical processes, including wafer bonding, laser lift-off, laser dicing & singulation, and wafer back grinding. Lead end-to-end activities for equipment lifecycle management, including procurement specification, evaluation, and purchase of new tools.
• Plan and execute engineering and operational activities within the area of responsibility to ensure stable production and support manufacturing targets. Work cross-functionally with manufacturing, engineering, and suppliers to ensure equipment readiness, process capability, and alignment with long-term technology roadmaps.
• Lead engineering efforts to support root cause identification of non-conformances, utilizing structured problem-solving methodologies; take ownership in implementing corrective and preventive actions (CAPA) to prevent recurrence.
• Establish and implement control measures to ensure compliance with ISO/TS 16949, ISO 45001, ISO 14001, and other applicable standards, while actively leading and supporting customer and certification audits.

• Degree / Master in EE / Mechatronic / Mechanical / Chemical Engineering
• Min. 10 years experience in manufacturing environment
• Min. 5 years experience in dicing/ grinding / LLO/ Bonding process engineering
• Fluency in English and Bahasa Malaysia.