Senior Staff Equipment Engineer (Grinding)

ams OSRAM; Kuala Lumpur; On-site; MYR 180,000 - 300,000; Full time

Job summary

ams OSRAM Opto Semiconductors in Malaysia is seeking a senior process engineer to lead and optimize dicing and grinding processes. You will drive process validation, SPC, FMEA and documentation to ensure robust manufacturing.

Collaborating with process and equipment engineers, you will implement continuous improvement, ensure quality, and align with change control and corrective actions.

Qualifications

• Experience in manufacturing with FMEA and SPC.
• Knowledge of dicing/grinding processes.

Responsibilities

• Lead, develop and optimize dicing/ grinding processes with SPC and LOD in place.
• Perform risk assessment using FMEA and derive control measures.
• Create and maintain documentation, certification & compliance per quality standards.
• Collaborate with Process & Equipment engineers to understand capabilities and product integration.
• Drive continuous improvement to reduce waste and increase tool uptime.
• Lead root-cause analysis and implement corrective and preventive actions.

Skills

Dicing & Grinding

SPC

FMEA

Documentation

Cross-functional work

Education

Degree/Master in EE, Mechatronics, Mechanical, or Chemical Eng

Job description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the‑art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

• Lead, develop and optimize dicing/ grinding process to ensure robustness of processes with Line of Defense (LOD), Statistical Process Control (SPC) etc control in place.
• To perform risk assessment using FMEA and derive control when needed. Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to quality standard & customer requirements.
• Interaction with Process & Equipment engineer to understand the Process & Equipment capability that influence towards the processes. To work with Product Integration Engineer/FPD/NPI to understand the product integration and process.
• Drive for continuous improvement initiatives to reduce waste, increase tool up time efficiency and improve quality for dicing/ gridining area.
• Collaborate with RBG counterparts to ensure both sites process changes is synchronized and develop future equipment strategy (CEPT/BEST) for dicing / grinding area which included procurement spec for equipment purchase, tool design improvement/PokaYoke, planning & execution within area of responsibility to support manufacturing activities.
• Leads engineering efforts in support of the root cause identification of non-conformances. Will take ownership of implementing corrective and preventive action.

• Degree / Master in EE / Mechatronic / Mechanical / Chemical Engineering
• Min. 10 years experience in manufacturing environment
• Min. 5 years experience in dicing/ grinding process engineering