Senior Staff Equipment Engineer (Dicing & Grinding)

ams OSRAM; Kulim; Hybrid; MYR 180,000 - 240,000; Full time

Job summary

ams OSRAM Opto Semiconductors is seeking a senior engineer to lead dicing and grinding process development, driving robust controls and continuous improvement across manufacturing lines. You will work with Process & Equipment engineers to optimize capabilities and reduce waste while ensuring high-quality outputs.

The ideal candidate has 10+ years in manufacturing with hands-on expertise in dicing and grinding, plus familiarity with SPC, FMEA and quality systems.

Qualifications

• Bachelor's or Master's degree in engineering fields as listed
• Minimum 10 years in a manufacturing environment
• At least 5 years in dicing/grinding process engineering
• Experience with SPC, FMEA and quality systems preferred

Responsibilities

• Lead, develop and optimize dicing/grinding processes with robust controls (LOD, SPC) in place
• Perform risk assessment using FMEA and implement controls as needed
• Create and maintain documentation, certification and compliance for procedures
• Collaborate with Process & Equipment engineers to understand capabilities affecting processes
• Drive continuous improvement to reduce waste, improve tool uptime and quality
• Coordinate with RBG counterparts to synchronize process changes and plan equipment strategy

Skills

Dicing process engineering

Grinding process engineering

Process optimization

Education

Electrical Engineering

Mechatronic Engineering

Mechanical Engineering

Chemical Engineering

Job description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the‑art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

• Lead, develop and optimize dicing/ grinding process to ensure robustness of processes with Line of Defense (LOD), Statistical Process Control (SPC) etc control in place.
• To perform risk assessment using FMEA and derive control when needed. Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to quality standard & customer requirements.
• Interaction with Process & Equipment engineer to understand the Process & Equipment capability that influence towards the processes. To work with Product Integration Engineer/FPD/NPI to understand the product integration and process.
• Drive for continuous improvement initiatives to reduce waste, increase tool up time efficiency and improve quality for dicing/ gridining area.
• Collaborate with RBG counterparts to ensure both sites process changes is synchronized and develop future equipment strategy (CEPT/BEST) for dicing / grinding area which included procurement spec for equipment purchase, tool design improvement/PokaYoke, planning & execution within area of responsibility to support manufacturing activities.
• Leads engineering efforts in support of the root cause identification of non-conformances. Will take ownership of implementing corrective and preventive action.

• Degree / Master in EE / Mechatronic / Mechanical / Chemical Engineering
• Min. 10 years experience in manufacturing environment
• Min. 5 years experience in dicing/ grinding process engineering