Senior Equipment Engineer: Dicing & Grinding Process Lead

ams OSRAM; Kuala Lumpur; On-site; MYR 180,000 - 300,000; Full time

Job summary

ams OSRAM Opto Semiconductors in Malaysia is seeking a senior process engineer to lead and optimize dicing and grinding processes. You will drive process validation, SPC, FMEA and documentation to ensure robust manufacturing.

Collaborating with process and equipment engineers, you will implement continuous improvement, ensure quality, and align with change control and corrective actions.

Qualifications

• Experience in manufacturing with FMEA and SPC.
• Knowledge of dicing/grinding processes.

Responsibilities

• Lead, develop and optimize dicing/ grinding processes with SPC and LOD in place.
• Perform risk assessment using FMEA and derive control measures.
• Create and maintain documentation, certification & compliance per quality standards.
• Collaborate with Process & Equipment engineers to understand capabilities and product integration.
• Drive continuous improvement to reduce waste and increase tool uptime.
• Lead root-cause analysis and implement corrective and preventive actions.

Skills

Dicing & Grinding

SPC

FMEA

Documentation

Cross-functional work

Education

Degree/Master in EE, Mechatronics, Mechanical, or Chemical Eng

Job description

ams OSRAM Opto Semiconductors in Malaysia is seeking a senior process engineer to lead and optimize dicing and grinding processes. You will drive process validation, SPC, FMEA and documentation to ensure robust manufacturing.

Collaborating with process and equipment engineers, you will implement continuous improvement, ensure quality, and align with change control and corrective actions.