Senior Dicing & Grinding Process Engineer

ams OSRAM; Kulim; Hybrid; MYR 180,000 - 240,000; Full time

Job summary

ams OSRAM Opto Semiconductors is seeking a senior engineer to lead dicing and grinding process development, driving robust controls and continuous improvement across manufacturing lines. You will work with Process & Equipment engineers to optimize capabilities and reduce waste while ensuring high-quality outputs.

The ideal candidate has 10+ years in manufacturing with hands-on expertise in dicing and grinding, plus familiarity with SPC, FMEA and quality systems.

Qualifications

• Bachelor's or Master's degree in engineering fields as listed
• Minimum 10 years in a manufacturing environment
• At least 5 years in dicing/grinding process engineering
• Experience with SPC, FMEA and quality systems preferred

Responsibilities

• Lead, develop and optimize dicing/grinding processes with robust controls (LOD, SPC) in place
• Perform risk assessment using FMEA and implement controls as needed
• Create and maintain documentation, certification and compliance for procedures
• Collaborate with Process & Equipment engineers to understand capabilities affecting processes
• Drive continuous improvement to reduce waste, improve tool uptime and quality
• Coordinate with RBG counterparts to synchronize process changes and plan equipment strategy

Skills

Dicing process engineering

Grinding process engineering

Process optimization

Education

Electrical Engineering

Mechatronic Engineering

Mechanical Engineering

Chemical Engineering

Job description

ams OSRAM Opto Semiconductors is seeking a senior engineer to lead dicing and grinding process development, driving robust controls and continuous improvement across manufacturing lines. You will work with Process & Equipment engineers to optimize capabilities and reduce waste while ensuring high-quality outputs.

The ideal candidate has 10+ years in manufacturing with hands-on expertise in dicing and grinding, plus familiarity with SPC, FMEA and quality systems.