Senior Process Engineer - Wafer Bonding, Grinding & Laser Dicing

ams-OSRAM AG; Kulim; On-site; MYR 180,000 - 240,000; Full time

Job summary

ams-OSRAM AG in Kulim, Malaysia seeks a senior Process Engineer to lead, develop and optimize the dicing and grinding processes, ensuring robust control with SPC and Line of Defense. You will work with process and equipment engineers to understand capabilities and drive improvements.

Responsibilities include performing FMEA risk assessments, creating documentation and compliance of procedures, implementing corrective and preventive actions, and coordinating with cross-site teams to align

Qualifications

• Degree/Master in the listed engineering fields
• Minimum 10 years manufacturing experience
• Minimum 5 years in dicing/grinding process engineering

Responsibilities

• Lead, develop and optimize dicing/grinding processes with SPC and LOD controls
• Perform risk assessment using FMEA and derive controls
• Collaborate with Process & Equipment engineers to understand capabilities
• Drive continuous improvement to reduce waste and increase line uptime
• Coordinate with cross-site teams to synchronize process changes and equipment strategy
• Lead root-cause investigations and implement corrective actions

Skills

SPC

FMEA

Continuous improvement

Documentation

Root cause analysis

Education

Degree / Master in Electrical & Electronics / Mechatronic / Mechanical / Chemical Engineering

Tools

Poka-Yoke

Job description

ams-OSRAM AG in Kulim, Malaysia seeks a senior Process Engineer to lead, develop and optimize the dicing and grinding processes, ensuring robust control with SPC and Line of Defense. You will work with process and equipment engineers to understand capabilities and drive improvements.

Responsibilities include performing FMEA risk assessments, creating documentation and compliance of procedures, implementing corrective and preventive actions, and coordinating with cross-site teams to align