Staff Equipment Engineer, Dicing & Grinding Optimization

ams OSRAM; Kulim; On-site; MYR 120,000 - 180,000; Full time

Job summary

ams OSRAM Opto Semiconductors seeks an experienced engineer to develop and optimize the dicing and grinding processes in Kedah. The role requires robust process control, risk assessment, and cross-functional collaboration with Process & Equipment engineering to ensure seamless product integration.

The ideal candidate will have 8+ years in manufacturing, with 3–5 years in dicing/grinding process engineering, and a degree in EE, Mechatronics, Mechanical or Chemical Engineering.

Qualifications

• Requires strong manufacturing experience in a semiconductor environment.
• Experience in dicing and grinding process engineering is essential.
• Familiarity with quality tools and process optimization is expected.

Responsibilities

• Develop and optimize dicing/ grinding process to ensure robustness of processes with Line of Defense (LOD), Statistical Process Control (SPC) etc control in place.
• Perform risk assessment using FMEA and derive control when needed. Create and maintain documentation, certification & compliance of procedure in assigned functional areas according to quality standard & customer requirements.
• Interact with Process & Equipment engineer to understand the Process & Equipment capability that influence towards the processes. To work with Product Integration Engineer/FPD/NPI to understand the product integration and process.
• Support for continuous improvement initiatives to reduce waste, increase tool up time efficiency and improve quality for dicing/ grinding area.
• Collaborate with RBG counterparts to ensure both sites process changes is synchronized and develop future equipment strategy (CEPT/BEST) for dicing / grinding area which included procurement spec for equipment purchase, tool design improvement/PokaYoke, planning & execution within area of responsibility to support manufacturing activities.
• Support of the root cause identification of non-conformances. Will take ownership of implementing corrective and preventive action.

Skills

Manufacturing experience

Dicing/grinding process engineering

Education

Degree / Master in EE / Mechatronic / Mechanical / Chemical Engineering

Job description

ams OSRAM Opto Semiconductors seeks an experienced engineer to develop and optimize the dicing and grinding processes in Kedah. The role requires robust process control, risk assessment, and cross-functional collaboration with Process & Equipment engineering to ensure seamless product integration.

The ideal candidate will have 8+ years in manufacturing, with 3–5 years in dicing/grinding process engineering, and a degree in EE, Mechatronics, Mechanical or Chemical Engineering.