Senior Staff Process Engineer: Laser Dicing & Bonding

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Kulim; On-site; MYR 90,000 - 120,000; Full time

Job summary

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd is seeking a Senior Staff Process Engineer to lead LLO, wafer bonding and grinding, and laser dicing processes at our Kulim site in Malaysia. The role focuses on process development, optimization, and integration with cross-functional teams to meet quality and throughput targets.

The ideal candidate has a minimum of 10 years in a manufacturing environment and at least 5 years in dicing, grinding, LLO, and bonding, with strong English and Bahasa

Qualifications

• Advanced degree in engineering fields; strong process engineering knowledge.
• Experience leading laser dicing, LLO, bonding and grinding processes.
• Familiarity with quality systems and risk assessment methods is preferred.

Responsibilities

• Lead development and optimization of laser dicing, singulation, LLO, wafer back grinding and bonding processes.
• Perform risk assessments (FMEA) and implement control measures to ensure product quality.
• Collaborate with Equipment Engineers and cross-functional teams to drive process improvements and tool upgrades.

Skills

Process engineering

LLO

Wafer bonding

Grinding

Laser dicing

Education

Degree/Master in EE/Mechatronic/Mechanical/Chemical Engineering

Tools

SPC

Quality audits

Job description

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd is seeking a Senior Staff Process Engineer to lead LLO, wafer bonding and grinding, and laser dicing processes at our Kulim site in Malaysia. The role focuses on process development, optimization, and integration with cross-functional teams to meet quality and throughput targets.

The ideal candidate has a minimum of 10 years in a manufacturing environment and at least 5 years in dicing, grinding, LLO, and bonding, with strong English and Bahasa