Senior Staff Process Engineer (LLO, Wafer Bonding & Grinding, Laser Dicing)

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Kulim; On-site; MYR 90,000 - 120,000; Full time

Job summary

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd is seeking a Senior Staff Process Engineer to lead LLO, wafer bonding and grinding, and laser dicing processes at our Kulim site in Malaysia. The role focuses on process development, optimization, and integration with cross-functional teams to meet quality and throughput targets.

The ideal candidate has a minimum of 10 years in a manufacturing environment and at least 5 years in dicing, grinding, LLO, and bonding, with strong English and Bahasa

Qualifications

• Advanced degree in engineering fields; strong process engineering knowledge.
• Experience leading laser dicing, LLO, bonding and grinding processes.
• Familiarity with quality systems and risk assessment methods is preferred.

Responsibilities

• Lead development and optimization of laser dicing, singulation, LLO, wafer back grinding and bonding processes.
• Perform risk assessments (FMEA) and implement control measures to ensure product quality.
• Collaborate with Equipment Engineers and cross-functional teams to drive process improvements and tool upgrades.

Skills

Process engineering

LLO

Wafer bonding

Grinding

Laser dicing

Education

Degree/Master in EE/Mechatronic/Mechanical/Chemical Engineering

Tools

SPC

Quality audits

Job description

Senior Staff Process Engineer (LLO, Wafer Bonding & Grinding, Laser Dicing) Language View Profile Employee Login Job Alerts Link Job Description Senior Staff Process Engineer (LLO, Wafer Bonding & Grinding, Laser Dicing) Kulim, Malaysia

The ams OSRAM Group is a global leader in innovative light and sensor solutions. As a specialist in Digital Photonics, we combine technological excellence with state-of-the-art global manufacturing capabilities to offer our customers the broadest portfolio of digital emitter and sensor technologies.
Globally, our teams develop groundbreaking solutions aligned with societal megatrends like intelligent mobility, artificial intelligence, augmented reality, smart health, and robotics.
At ams OSRAM, employees are part of a highly innovative, international technology environment. Diverse teams, a high degree of ownership, and exciting challenges provide the opportunity to grow, develop, and make a real difference. Because behind our innovations are people who carry something special inside and who bring their unique strengths to work every day.

Show the world what you are made of.

Your new responsibilities

• Lead process development and optimization for laser dicing & singulation/ wafer back grinding / laser lift off (LLO)/ wafer bonding. Define and optimize process parameter to meet quality, yield, and throughput target. Ensured process robustness through implementation of LOD, SPC, and advanced control strategies. Improved process stability and reduced variation through data-driven analysis and continuous monitoring
• Perform risk assessments using FMEA (Failure Mode and Effects Analysis) to identify potential failure modes, evaluate risks, and implement appropriate control measures to mitigate them. Establish, review, and maintain process controls and mitigation plans to ensure product quality, process stability, and compliance with operational standards. Ensure all processes and documentation meet quality standards, regulatory requirements, and customer specifications, supporting audit readiness and continuous compliance.
• Engage closely with Equipment Engineers to gain a deep understanding of process and equipment capabilities, and evaluate their impact on overall manufacturing processes and performance. Collaborate with Product Integration, FPD, and NPI teams to understand product requirements, integration flows, and process interactions, ensuring alignment between equipment capability and product specifications. Drive continuous improvement initiatives, focusing on tool design enhancements and implementation of Poka-Yoke (error-proofing) solutions to improve yield, reliability, operational efficiency and tool up time efficiency for laser dicing/ wafer grinding / Laser lif Off/ wafer bonding.
• Collaborate closely with RBG (Regional/Remote Business Group) counterparts to ensure synchronization of process changes and seamless implementation across both sites. Develop and drive future equipment strategy (CEPT/BEST) for critical processes, including wafer bonding, laser lift-off, laser dicing & singulation, and wafer back grinding. Lead end-to-end activities for equipment lifecycle management, including procurement specification, evaluation, and purchase of new tools.
• Plan and execute engineering and operational activities within the area of responsibility to ensure stable production and support manufacturing targets. Work cross-functionally with manufacturing, engineering, and suppliers to ensure equipment readiness, process capability, and alignment with long-term technology roadmaps.
• Lead engineering efforts to support root cause identification of non-conformances, utilizing structured problem-solving methodologies; take ownership in implementing corrective and preventive actions (CAPA) to prevent recurrence.
• Establish and implement control measures to ensure compliance with ISO/TS 16949, ISO 45001, ISO 14001, and other applicable standards, while actively leading and supporting customer and certification audits.

What we look for

• Degree / Master in EE / Mechatronic / Mechanical / Chemical Engineering
• Min. 10 years experience in manufacturing environment
• Min. 5 years experience in dicing/ grinding / LLO/ Bonding process engineering
• Fluency in English and Bahasa Malaysia.

Please contact Shin Yih Cheah for further information via [e-mail] .

ams OSRAM is an Equal Employment Opportunity Employer. Diversity, equity and inclusion is strongly established in our corporate culture and we firmly believe it makes us more successful as a company. All qualified applications will receive consideration for employment regardless of ethnic, national or social origin, gender, gender identity, sexual orientation, color, religion, age, physical and mental abilities.

Information at a Glance Job ID: 24476 Posting Start Date: 10/14/26 Job Family: Career Level: Experienced Professional (>8 years) Company: Schedules: Full Time Work Model: On-Site Job Shift: Flex time Regular/Temporary: Department:

Application deadline: As long as the job is listed on our career page, we are looking for suitable candidates. We look forward to receiving your application.

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