Senior Die Bond Engineer – Precision Optics & Automation

Lumentum; Seberang Perai; Presencial; MYR 120.000 - 180.000; Jornada completa

Descripción de la vacante

Lumentum in Penang, Malaysia, seeks a Senior / Principal Process Engineer – Die Bond to lead high‑precision die bond and die attach processes, including laser die‑to‑submount assembly, and to partner with R&D, Quality, Operations and CM teams.

This role covers process development, transfer to manufacturing, qualification, yield improvement, and manufacturing readiness for high‑volume production, with hands‑on troubleshooting and mentoring of junior engineers.

Formación

• Bachelor’s degree or higher in a technical field.
• 8+ years in process/manufacturing engineering (senior) or 10+ years with leadership (principal).
• Experience with optoelectronic devices or precision assembly.
• NPI, process development, qualification, transfer to high-volume manufacturing.
• Hands-on die bond/die attach experience; laser die-to-submount preferred.
• Strong SPC, Cp/Cpk, DOE, stats and problem solving.
• Experience with contract manufacturers and cross-functional teams.
• Good English communication; willingness to travel internationally.

Responsabilidades

• Develop, characterize, optimize, qualify, and sustain die bond/die attach processes.
• Own process parameters: placement/alignment, bonding force/temperature/time, bond-line thickness, materials, tooling, collet.
• Define process windows, control methods, acceptance criteria and capability requirements.
• Transfer new products from R&D into CM, ensure process readiness and ramp.
• Plan and execute First Article, CM qualification, process validation and readiness activities.
• Support product transitions from development to high-volume manufacturing.
• Maintain manufacturing docs: work instructions, specs, control plans.
• Lead yield improvements, root-cause investigations and corrective actions.
• Mentor junior engineers and lead cross-functional projects.
• Collaborate with R&D, Quality, Operations, Supply Chain, and suppliers.

Conocimientos

Die bond

Process development

SPC

DOE

Problem solving

Cross-functional leadership

English communication

Travel internationally

Educación

Bachelor's degree (engineering/related)

Herramientas

ASM

AMICRA

Silicool

Palomar

Descripción del empleo

Lumentum in Penang, Malaysia, seeks a Senior / Principal Process Engineer – Die Bond to lead high‑precision die bond and die attach processes, including laser die‑to‑submount assembly, and to partner with R&D, Quality, Operations and CM teams.

This role covers process development, transfer to manufacturing, qualification, yield improvement, and manufacturing readiness for high‑volume production, with hands‑on troubleshooting and mentoring of junior engineers.