Senior Process Development Engineer – Semiconductors

ams-OSRAM AG; Bayan Lepas; Sur place; MYR 60 000 - 90 000; Plein temps

Résumé du poste

ams OSRAM AG in Bayan Lepas, Penang, Malaysia, seeks a process engineer to develop, qualify, and optimize wafer/die sawing and related processes to achieve quality and manufacturing performance.

You will lead DOE studies, apply DMAIC/8D and Six Sigma methods, analyze data, and drive yield, cycle time, and cost improvements in a cross-functional setting with Operations, Quality, Product Engineering, and R&D teams.

Qualifications

• Bachelor's degree in Engineering, Materials Science, Physics, or a related field.
• Minimum 2 years of semiconductor process engineering experience.
• Hands-on experience in semiconductor or LED manufacturing processes.
• Familiarity with FOL processes such as sawing, die attach, and wire bond is preferred.
• Experience in Process Development or New Product Introduction (NPI) is an advantage.
• Strong analytical, troubleshooting, and problem-solving skills.
• Familiarity with statistical analysis, SPC, DOE, and Six Sigma methodologies.
• Proficient in Microsoft Excel, Word, PowerPoint, and Minitab.
• Good communication and teamwork skills in a cross-functional manufacturing environment.
• Fresh Graduates are encouraged to apply.

Responsabilités

• Develop, qualify, and optimize wafer/die sawing processes to achieve targeted product quality, reliability, and manufacturing performance.
• Conduct process studies and Design of Experiments (DOE) to improve process capability, yield, and overall efficiency.
• Define and maintain robust process parameters and operating windows for stable production.
• Lead process qualification and industrialization activities, supporting the transition from development to high-volume manufacturing.
• Drive continuous improvements in yield, cycle time, equipment utilization, and manufacturing cost.
• Analyze process, yield, and equipment data to identify root causes of technical and quality issues.
• Apply structured problem-solving methodologies such as DMAIC, 8D, FMEA, and Fishbone Analysis to resolve manufacturing challenges.
• Implement corrective and preventive actions to prevent recurring process excursions and defects.
• Utilize statistical tools and methodologies, including SPC, Cp/Cpk analysis, control charts, and trend analysis, to monitor and improve process performance.
• Plan and execute statistically sound experiments to optimize process capability and manufacturing robustness.
• Prepare technical reports, data analysis, and recommendations to support engineering decisions.
• Lead Lean Six Sigma and operational excellence initiatives to improve productivity, reduce waste, and lower manufacturing costs.Collaborate closely with Operations, Equipment Engineering, Quality Engineering, Product Engineering, Reliability Engineering, and R&D teams to resolve technical issues and support new product introductions.
• Support customer audits, technology transfers, benchmarking activities, and cross-site knowledge sharing to promote best practices across the organization.

Connaissances

Analytical thinking

Troubleshooting

Problem-solving

Statistical analysis

DOE

Six Sigma

Cross-functional collaboration

Communication

Formation

Bachelor’s degree in Engineering, Materials Science, Physics or related field

Outils

Minitab

MS Excel

MS Word

PowerPoint

Description du poste

ams OSRAM AG in Bayan Lepas, Penang, Malaysia, seeks a process engineer to develop, qualify, and optimize wafer/die sawing and related processes to achieve quality and manufacturing performance.

You will lead DOE studies, apply DMAIC/8D and Six Sigma methods, analyze data, and drive yield, cycle time, and cost improvements in a cross-functional setting with Operations, Quality, Product Engineering, and R&D teams.