Process Development Senior Engineer (Die Attach / Wire Bond)

OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang; Bayan Lepas; Sur place; MYR 89 000 - 134 000; Plein temps

Résumé du poste

OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang is seeking a process engineer to develop or optimize Die Attach and Wire Bond processes for new product development while meeting cost, quality, and timeline targets.

You will participate in FOL process technology roadmap activities, select suitable equipment, and transfer technical know-how to R&D and Manufacturing teams, mentoring junior staff where applicable.

Qualifications

• Bachelor's or Master's in Electrical/Electronics/Mechatronics/Mechanical Engineering or equivalent required.
• 2-3 years in semiconductor field, especially Die Attach and Wire Bond processes.
• Process engineering knowledge in semiconductors or LED manufacturing processes.

Responsabilités

• Develop or optimize Die Attach and Wire Bond processes for new product development projects.
• Participate in and support FOL process technology roadmap and building block activities.
• Select equipment meeting project cost, quality and timeline targets.
• Share and transfer technical know-how within R&D and to Manufacturing.

Connaissances

Die Attach

Wire Bond

Process Engineering

Statistical Methods

Minitab

Six Sigma Green/Black Belt

Formation

Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent

Description du poste

Requisition ID24297-Posted10/05/2026

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends. Find out more about us on https://ams-osram.com

Your new responsibilities

• Develop or optimize Die Attach and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.
• Participate and support FOL processes tehcnology roadmap and building block activities.
• Equipment selection which meet project cost, quality and timeline target.
• Share and transfer technical know how within R&D and to Manufacturing team.
• Provide technical guidance or job coaching to junior supporting staff
• Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.

What we look for

• Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
• 2-3 years in semiconductor field especially in Die Attach and Wire Bond processes.
• Process egnineering knowledge in semiconductors or LED manufacturing processes.
• Knowledge in process development step and statistic.
• B. Minitab knowledge will be advantage.
• Six Sigma Green or Black Belt will be advantage.